Inventor
HAYASHIDA TETSUYA
JP32 patents
⚠️ This page may combine multiple inventors who share the name “HAYASHIDA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
26 patentsUS5219794AJun 15, 1993
Semiconductor integrated circuit device and method of fabricating same
HITACHI LTD149 citations99
US6208525B1Mar 27, 2001
Process for mounting electronic device and semiconductor device
HITACHI LTD270 citations98
US6471115B1Oct 29, 2002
Process for manufacturing electronic circuit devices
HITACHI LTD91 citations97
US6227436B1May 8, 2001
Method of fabricating an electronic circuit device and apparatus for performing the method
HITACHI LTD68 citations96
US6111322AAug 29, 2000
Semiconductor device and manufacturing method thereof
HITACHI LTD59 citations96
US5865365AFeb 2, 1999
Method of fabricating an electronic circuit device
HITACHI LTD132 citations96
US5217922AJun 8, 1993
Method for forming a silicide layer and barrier layer on a semiconductor device rear surface
HITACHI LTD108 citations96
US6780677B2Aug 24, 2004
Process for mounting electronic device and semiconductor device
HITACHI LTD43 citations95
US5849606ADec 15, 1998
Semiconductor device and manufacturing of the same
HITACHI LTD53 citations94
US5276586AJan 4, 1994
Bonding structure of thermal conductive members for a multi-chip module
HITACHI LTD69 citations94
US4805147AFeb 14, 1989
Stacked static random access memory cell having capacitor
HITACHI LTD54 citations93
US4575399AMar 11, 1986
Method of pattern detection
HITACHI LTD40 citations93
US4563241AJan 7, 1986
Method of forming patterns
HITACHI LTD26 citations93
US6737741B2May 18, 2004
Process for mounting electronic device and semiconductor device
HITACHI LTD13 citations92
US6461896B1Oct 8, 2002
Process for mounting electronic device and semiconductor device
HITACHI LTD27 citations92
US6380621B1Apr 30, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD39 citations92
US5878943AMar 9, 1999
Method of fabricating an electronic circuit device and apparatus for performing the method
HITACHI LTD51 citations92
US5341980AAug 30, 1994
Method of fabricating electronic circuit device and apparatus for performing the same method
HITACHI LTD35 citations92
US4243506AJan 6, 1981
Plasma-etching apparatus
HITACHI LTD35 citations91
US5885852AMar 23, 1999
Packaged semiconductor device having a flange at its side surface and its manufacturing method
HITACHI LTD25 citations90
US5816473AOct 6, 1998
Method of fabricating electronic circuit device and apparatus for performing the same method
HITACHI LTD15 citations82
US4887145ADec 12, 1989
Semiconductor device in which electrodes are formed in a self-aligned manner
HITACHI LTD18 citations74
US4812894AMar 14, 1989
Semiconductor device
HITACHI LTD17 citations74
US4956688ASep 11, 1990
Radiation resistant bipolar memory
HITACHI LTD13 citations73
US4858184AAug 15, 1989
Radiation resistant bipolar memory
HITACHI LTD7 citations73
US4958320ASep 18, 1990
Radiation resistant bipolar memory
HITACHI LTD5 citations62
RENESAS TECH CORP
3 patentsUS6767767B2Jul 27, 2004
Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate
RENESAS TECH CORP29 citations91
US6787442B2Sep 7, 2004
Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal
RENESAS TECH CORP14 citations84
US6781234B2Aug 24, 2004
Semiconductor device having electrodes containing at least copper nickel phosphorous and tin
RENESAS TECH CORP13 citations84