Inventor · disambiguated record

Jerry Jie Li Aw

Also filed as: AW JERRY JIE LI

1 granted patent·4 citations·filing 2015–2015

24Inventor score

Technology areasH10W

Files withAGENCY SCIENCE TECH & RES1

Top patents by PatentIndex Score

1 record

0177US10249593B2Method for bonding a chip to a waferAGENCY SCIENCE TECH & RES·Filed 2015·Granted Apr 2, 2019·4 cites·8 claims

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