Inventor

MATSUKUMA HIDEMI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “MATSUKUMA HIDEMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC ELECTRONICS CORP

2 patents

US6575348B2Jun 10, 2003

Wire bonding apparatus with spurious vibration suppressing structure

NEC ELECTRONICS CORP9 citations70

US6779702B2Aug 24, 2004

Wire bonding apparatus with spurious vibration suppressing structure

NEC ELECTRONICS CORP0 citations48

NEC CORP

1 patent

US5535789AJul 16, 1996

Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire

NEC CORP5 citations60