Inventor
LYKINS JAMES L
US3 patents
Patents
3 patentsUS6262579B1Jul 17, 2001
Method and structure for detecting open vias in high density interconnect substrates
KULICKE & SOFFA HOLDINGS INC59 citations93
US6165892ADec 26, 2000
Method of planarizing thin film layers deposited over a common circuit base
KULICKE & SOFFA HOLDINGS INC60 citations92
US6440641B1Aug 27, 2002
Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates
KULICKE & SOFFA HOLDINGS INC29 citations89