Inventor

CHEUNG WAI YUEN

CN4 patents

⚠️ This page may combine multiple inventors who share the name “CHEUNG WAI YUEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASM ASSEMBLY AUTOMATION LTD

1 patent

US6991967B2Jan 31, 2006

Apparatus and method for die attachment

ASM ASSEMBLY AUTOMATION LTD8 citations70

ASM TECH SINGAPORE PTE LTD

1 patent

US10882298B2Jan 5, 2021

System for adjusting relative positions between components of a bonding apparatus

ASM TECH SINGAPORE PTE LTD1 citations53

LAM KUI KAM

1 patent

US8590143B2Nov 26, 2013

Apparatus for delivering semiconductor components to a substrate

LAM KUI KAM0 citations32

CHUNG KWOK KEE

1 patent

US8293043B2Oct 23, 2012

Automatic level adjustment for die bonder

CHUNG KWOK KEE0 citations30