Inventor

AMETANI MINORU

JP20 patents

⚠️ This page may combine multiple inventors who share the name “AMETANI MINORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AMETANI MINORU

TOKYO SEIMITSU CO LTD

Dicing tape attaching apparatus and dicing tape attaching method

Method and apparatus for peeling surface protective film

Tape adhering method and tape adhering apparatus

Apparatus for attaching a peeling tape

Film separation method and film separation apparatus

Film peeling method and film peeling device

Workpiece processing device

Wafer processing apparatus

NITTO DENKO CORP

Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith

Apparatus for applying and removing protective adhesive tape to/from semiconductor wafer surfaces

Process for peeling protective film off a wafer

Method and apparatus for removing unwanted substance from semiconductor wafer

Wafer shape detecting method

NITTO ELECTRIC IND CO

Apparatus for peeling protective film off a thin article

Process for peeling protective film off a thin article

Sticking and cutoff device for adhering adhesive tape on thin articles

Process for peeling protective film off a thin article

Apparatus for sticking adhesive film on a ring and a thin article

KAWASHIMA ISAMU

Surface protection film peeling method and surface protection film peeling device

Tape adhering method and tape adhering device