Inventor
CONNELLY DANIEL J
US38 patents
⚠️ This page may combine multiple inventors who share the name “CONNELLY DANIEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ACORN TECH INC
27 patentsUS7112478B2Sep 26, 2006
Insulated gate field effect transistor having passivated Schottky barriers to the channel
ACORN TECH INC84 citations99
US10090395B2Oct 2, 2018
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC18 citations98
US7176483B2Feb 13, 2007
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC66 citations98
US7084423B2Aug 1, 2006
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC62 citations97
US6891234B1May 10, 2005
Transistor with workfunction-induced charge layer
ACORN TECH INC199 citations97
US9905691B2Feb 27, 2018
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC16 citations96
US9461167B2Oct 4, 2016
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC18 citations96
US9209261B2Dec 8, 2015
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC22 citations96
US7884003B2Feb 8, 2011
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC26 citations96
US7462860B2Dec 9, 2008
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC23 citations96
US6833556B2Dec 21, 2004
Insulated gate field effect transistor having passivated schottky barriers to the channel
ACORN TECH INC36 citations96
US7700416B1Apr 20, 2010
Tensile strained semiconductor on insulator using elastic edge relaxation and a sacrificial stressor layer
ACORN TECH INC53 citations94
US8916437B2Dec 23, 2014
Insulated gate field effect transistor having passivated schottky barriers to the channel
ACORN TECH INC13 citations92
US8766336B2Jul 1, 2014
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC11 citations92
US8377767B2Feb 19, 2013
Insulated gate field effect transistor having passivated schottky barriers to the channel
ACORN TECH INC14 citations92
US7883980B2Feb 8, 2011
Insulated gate field effect transistor having passivated schottky barriers to the channel
ACORN TECH INC23 citations92
US7851325B1Dec 14, 2010
Strained semiconductor using elastic edge relaxation, a buried stressor layer and a sacrificial stressor layer
ACORN TECH INC23 citations92
US7382021B2Jun 3, 2008
Insulated gate field-effect transistor having III-VI source/drain layer(s)
ACORN TECH INC32 citations91
US10388748B2Aug 20, 2019
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC2 citations84
US9812542B2Nov 7, 2017
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC2 citations84
US9583614B2Feb 28, 2017
Insulated gate field effect transistor having passivated schottky barriers to the channel
ACORN TECH INC3 citations84
US7972916B1Jul 5, 2011
Method of forming a field effect transistors with a sacrificial stressor layer and strained source and drain regions formed in recesses
ACORN TECH INC14 citations84
US7902029B2Mar 8, 2011
Process for fabricating a self-aligned deposited source/drain insulated gate field-effect transistor
ACORN TECH INC10 citations83
US7816240B2Oct 19, 2010
Method for making semiconductor insulated-gate field-effect transistor having multilayer deposited metal source(s) and/or drain(s)
ACORN TECH INC14 citations83
US10186592B2Jan 22, 2019
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN TECH INC0 citations63
US8003486B2Aug 23, 2011
Method of making a semiconductor device having a strained semiconductor active region using edge relaxation, a buried stressor layer and a sacrificial stressor layer
ACORN TECH INC4 citations63
US11043571B2Jun 22, 2021
Insulated gate field effect transistor having passivated schottky barriers to the channel
ACORN TECH INC0 citations62
ACORN SEMI LLC
5 patentsUS11355613B2Jun 7, 2022
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN SEMI LLC0 citations73
US11056569B2Jul 6, 2021
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN SEMI LLC0 citations73
US11018237B2May 25, 2021
Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN SEMI LLC0 citations73
US10950707B2Mar 16, 2021
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN SEMI LLC1 citations73
US10937880B2Mar 2, 2021
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
ACORN SEMI LLC0 citations73
GRUPP DANIEL E
3 patentsUS9425277B2Aug 23, 2016
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
GRUPP DANIEL E18 citations95
US8431469B2Apr 30, 2013
Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
GRUPP DANIEL E11 citations92
US8263467B2Sep 11, 2012
Process for fabricating a self-aligned deposited source/drain insulated gate field-effect transistor
GRUPP DANIEL E18 citations91