P

Inventor

CONNELLY DANIEL J

US38 patents
⚠️ This page may combine multiple inventors who share the name “CONNELLY DANIEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ACORN TECH INC

27 patents
US7112478B2Sep 26, 2006

Insulated gate field effect transistor having passivated Schottky barriers to the channel

ACORN TECH INC84 citations99
US10090395B2Oct 2, 2018

Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC18 citations98
US7176483B2Feb 13, 2007

Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC66 citations98
US7084423B2Aug 1, 2006

Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC62 citations97
US6891234B1May 10, 2005

Transistor with workfunction-induced charge layer

ACORN TECH INC199 citations97
US9905691B2Feb 27, 2018

Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC16 citations96
US9461167B2Oct 4, 2016

Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC18 citations96
US9209261B2Dec 8, 2015

Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC22 citations96
US7884003B2Feb 8, 2011

Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC26 citations96
US7462860B2Dec 9, 2008

Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC23 citations96
US6833556B2Dec 21, 2004

Insulated gate field effect transistor having passivated schottky barriers to the channel

ACORN TECH INC36 citations96
US7700416B1Apr 20, 2010

Tensile strained semiconductor on insulator using elastic edge relaxation and a sacrificial stressor layer

ACORN TECH INC53 citations94
US8916437B2Dec 23, 2014

Insulated gate field effect transistor having passivated schottky barriers to the channel

ACORN TECH INC13 citations92
US8766336B2Jul 1, 2014

Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC11 citations92
US8377767B2Feb 19, 2013

Insulated gate field effect transistor having passivated schottky barriers to the channel

ACORN TECH INC14 citations92
US7883980B2Feb 8, 2011

Insulated gate field effect transistor having passivated schottky barriers to the channel

ACORN TECH INC23 citations92
US7851325B1Dec 14, 2010

Strained semiconductor using elastic edge relaxation, a buried stressor layer and a sacrificial stressor layer

ACORN TECH INC23 citations92
US7382021B2Jun 3, 2008

Insulated gate field-effect transistor having III-VI source/drain layer(s)

ACORN TECH INC32 citations91
US10388748B2Aug 20, 2019

Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC2 citations84
US9812542B2Nov 7, 2017

Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC2 citations84
US9583614B2Feb 28, 2017

Insulated gate field effect transistor having passivated schottky barriers to the channel

ACORN TECH INC3 citations84
US7972916B1Jul 5, 2011

Method of forming a field effect transistors with a sacrificial stressor layer and strained source and drain regions formed in recesses

ACORN TECH INC14 citations84
US7902029B2Mar 8, 2011

Process for fabricating a self-aligned deposited source/drain insulated gate field-effect transistor

ACORN TECH INC10 citations83
US7816240B2Oct 19, 2010

Method for making semiconductor insulated-gate field-effect transistor having multilayer deposited metal source(s) and/or drain(s)

ACORN TECH INC14 citations83
US10186592B2Jan 22, 2019

Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions

ACORN TECH INC0 citations63
US8003486B2Aug 23, 2011

Method of making a semiconductor device having a strained semiconductor active region using edge relaxation, a buried stressor layer and a sacrificial stressor layer

ACORN TECH INC4 citations63
US11043571B2Jun 22, 2021

Insulated gate field effect transistor having passivated schottky barriers to the channel

ACORN TECH INC0 citations62

ACORN SEMI LLC

5 patents

GRUPP DANIEL E

3 patents

FAULKNER CARL M

1 patent

GOEBEL ANDREAS

1 patent

CLIFTON PAUL

1 patent