Inventor
HSU YING-CHIH
TW24 patents
⚠️ This page may combine multiple inventors who share the name “HSU YING-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
16 patentsUS11671010B2Jun 6, 2023
Power delivery for multi-chip-package using in-package voltage regulator
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11855539B2Dec 26, 2023
Power module
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11245329B2Feb 8, 2022
Power module
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11158448B2Oct 26, 2021
Packaging layer inductor
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10151644B2Dec 11, 2018
Combination current generator configured to selectively generate one of a PTAT and a CTAT current
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US12500157B2Dec 16, 2025
Semiconductor package device with integrated inductor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12155307B2Nov 26, 2024
Power module
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046544B2Jul 23, 2024
Semiconductor package device with integrated inductor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002770B2Jun 4, 2024
Power management semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11450595B2Sep 20, 2022
Semiconductor package device with integrated inductor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11075136B2Jul 27, 2021
Heat transfer structures and methods for IC packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12422470B2Sep 23, 2025
Semiconductor packages with through via structures and methods for testing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11271482B2Mar 8, 2022
DC-DC converter and DC-DC converter operation method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11204614B2Dec 21, 2021
Current balance circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10559517B2Feb 11, 2020
Heat transfer structures and methods for IC packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163751B2Dec 25, 2018
Heat transfer structures and methods for IC packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52