P

Inventor

HSU YING-CHIH

TW24 patents
⚠️ This page may combine multiple inventors who share the name “HSU YING-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

16 patents
US11671010B2Jun 6, 2023

Power delivery for multi-chip-package using in-package voltage regulator

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11855539B2Dec 26, 2023

Power module

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11245329B2Feb 8, 2022

Power module

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11158448B2Oct 26, 2021

Packaging layer inductor

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10151644B2Dec 11, 2018

Combination current generator configured to selectively generate one of a PTAT and a CTAT current

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US12500157B2Dec 16, 2025

Semiconductor package device with integrated inductor and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12155307B2Nov 26, 2024

Power module

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046544B2Jul 23, 2024

Semiconductor package device with integrated inductor and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002770B2Jun 4, 2024

Power management semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11450595B2Sep 20, 2022

Semiconductor package device with integrated inductor and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11075136B2Jul 27, 2021

Heat transfer structures and methods for IC packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12422470B2Sep 23, 2025

Semiconductor packages with through via structures and methods for testing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11271482B2Mar 8, 2022

DC-DC converter and DC-DC converter operation method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11204614B2Dec 21, 2021

Current balance circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10559517B2Feb 11, 2020

Heat transfer structures and methods for IC packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163751B2Dec 25, 2018

Heat transfer structures and methods for IC packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

TAIWAN SEMICONDUCTOR MFG

3 patents

SOENEN ERIC

1 patent

ROTH ALAN

1 patent

HUANG JUI-CHENG

1 patent

SHI JUSTIN

1 patent

HSU YING-CHIH

1 patent