Inventor
WAGNER ISRAEL
IL19 patents
⚠️ This page may combine multiple inventors who share the name “WAGNER ISRAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATERIALS RESEARCH CORP
7 patentsUS5415753AMay 16, 1995
Stationary aperture plate for reactive sputter deposition
MATERIALS RESEARCH CORP594 citations98
US5126028AJun 30, 1992
Sputter coating process control method and apparatus
MATERIALS RESEARCH CORP177 citations96
US4871433AOct 3, 1989
Method and apparatus for improving the uniformity ion bombardment in a magnetron sputtering system
MATERIALS RESEARCH CORP89 citations96
US4957605ASep 18, 1990
Method and apparatus for sputter coating stepped wafers
MATERIALS RESEARCH CORP118 citations95
US5409590AApr 25, 1995
Target cooling and support for magnetron sputter coating apparatus
MATERIALS RESEARCH CORP36 citations92
US5130005AJul 14, 1992
Magnetron sputter coating method and apparatus with rotating magnet cathode
MATERIALS RESEARCH CORP53 citations92
US5080772AJan 14, 1992
Method of improving ion flux distribution uniformity on a substrate
MATERIALS RESEARCH CORP17 citations73
IBM
7 patentsUS6744395B1Jun 1, 2004
Power-scalable asynchronous architecture for a wave-pipelined analog to digital converter
IBM20 citations90
US6658368B2Dec 2, 2003
On-chip histogram testing
IBM14 citations81
US6577649B1Jun 10, 2003
Multiplexer for asynchronous data
IBM19 citations81
US6420663B1Jul 16, 2002
One layer spider interconnect
IBM11 citations73
US6566934B1May 20, 2003
Charge cancellation circuit for switched capacitor applications
IBM9 citations72
US9263096B1Feb 16, 2016
Voltage comparator circuit and usage thereof
IBM2 citations60
US9299458B1Mar 29, 2016
Voltage comparator circuit and usage thereof
IBM0 citations49
TOKYO ELECTRON LTD
3 patentsUS6416635B1Jul 9, 2002
Method and apparatus for sputter coating with variable target to substrate spacing
TOKYO ELECTRON LTD29 citations92
US5958134ASep 28, 1999
Process equipment with simultaneous or sequential deposition and etching capabilities
TOKYO ELECTRON LTD28 citations89
US6623606B2Sep 23, 2003
Method and apparatus for sputter coating with variable target to substrate spacing
TOKYO ELECTRON LTD13 citations84