Inventor

CHENG TSUN-MIN

TW45 patents

⚠️ This page may combine multiple inventors who share the name “CHENG TSUN-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG TSUN-MIN

UNITED MICROELECTRONICS CORP

Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same

Method for forming semiconductor structure having TiN layer

Semiconductor device and method for fabricating the same

Dynamic random access memory device

Method of fabricating bit line

Method of forming dynamic random access memory device

Dynamic random access memory device

Semiconductor memory device

Method for fabricating buried word line of a dynamic random access memory

Method for fabricating semiconductor device

Buried word line of a dynamic random access memory and method for fabricating the same

Semiconductor device and method for fabricating the same

Buried word line of a dynamic random access memory and method for fabricating the same

Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same

Bit line utilized in DRAM

Method of forming a semiconductor structure

Method for manufacturing a semiconductor device with a cobalt silicide film

Method for fabricating semiconductor device

Storage node contact structure of a memory device

Semiconductor device and method for fabricating the same

Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same

Bit line gate structure of dynamic random access memory (DRAM) and forming method thereof

Semiconductor device and method of forming the same

Manufacturing method of metal gate structure

Structure of metal gate structure and manufacturing method of the same

Semiconductor device and method for fabricating the same

Storage node contact structure of a memory device and manufacturing methods thereof

Fabricating method of cobalt silicide layer coupled to contact plug

Semiconductor device and method for fabricating the same

Through silicon via (TSV) process

Transistor and semiconductor structure

Semiconductor device and method for fabricating the same

Metal gate structure and fabrication method thereof

Electrical chemical plating process

Semiconductor device having bilayer metal layer

Chen jia-jia

Through silicon via process

Through silicon via (TSV) structure and process thereof

FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD

Semiconductor memory device having interface layer between capacitor structures and method of fabricating the same

Semiconductor device and method of fabricating the same

TSAI MIN-CHUAN

Semiconductor structure and process thereof

NEXCHIP SEMICONDUCTOR CORP

Semiconductor structure and method of forming same

HUANG HSIN-FU

Method for fabricating interconnection structure with dry-cleaning process

CHENG TSUN-MIN

Metal gate structure and fabrication method thereof

LU YEN-LIANG

Method for fabricating through-silicon via structure

LIN CHUN-LING

Electrical chemical plating process