P

Inventor

TSAI MIN-CHUAN

TW28 patents
⚠️ This page may combine multiple inventors who share the name “TSAI MIN-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

20 patents
US9679813B2Jun 13, 2017

Semiconductor structure and process for forming plug including layer with pulled back sidewall part

UNITED MICROELECTRONICS CORP9 citations84
US9018086B2Apr 28, 2015

Semiconductor device having a metal gate and fabricating method thereof

UNITED MICROELECTRONICS CORP7 citations84
US8735269B1May 27, 2014

Method for forming semiconductor structure having TiN layer

UNITED MICROELECTRONICS CORP7 citations84
US10199269B2Feb 5, 2019

Conductive structure and method for manufacturing conductive structure

UNITED MICROELECTRONICS CORP6 citations83
US9887158B1Feb 6, 2018

Conductive structure having an entrenched high resistive layer

UNITED MICROELECTRONICS CORP5 citations83
US9755047B2Sep 5, 2017

Semiconductor process and semiconductor device

UNITED MICROELECTRONICS CORP2 citations73
US9735015B1Aug 15, 2017

Fabricating method of semiconductor structure

UNITED MICROELECTRONICS CORP2 citations72
US9640482B1May 2, 2017

Semiconductor device with a contact plug and method of fabricating the same

UNITED MICROELECTRONICS CORP6 citations72
US10199228B2Feb 5, 2019

Manufacturing method of metal gate structure

UNITED MICROELECTRONICS CORP0 citations52
US10068797B2Sep 4, 2018

Semiconductor process for forming plug

UNITED MICROELECTRONICS CORP0 citations52
US9985110B2May 29, 2018

Semiconductor process

UNITED MICROELECTRONICS CORP0 citations52
US9653300B2May 16, 2017

Structure of metal gate structure and manufacturing method of the same

UNITED MICROELECTRONICS CORP0 citations52
US9570348B2Feb 14, 2017

Method of forming contact strucutre

UNITED MICROELECTRONICS CORP1 citations52
US10497617B2Dec 3, 2019

Conductive structure and method for manufacturing conductive structure

UNITED MICROELECTRONICS CORP0 citations51
US10192826B2Jan 29, 2019

Conductive layout structure including high resistive layer

UNITED MICROELECTRONICS CORP0 citations51
US9478628B1Oct 25, 2016

Metal gate forming process

UNITED MICROELECTRONICS CORP1 citations51
US9130032B2Sep 8, 2015

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US9076784B2Jul 7, 2015

Transistor and semiconductor structure

UNITED MICROELECTRONICS CORP0 citations51
US9281374B2Mar 8, 2016

Metal gate structure and fabrication method thereof

UNITED MICROELECTRONICS CORP1 citations50
US9558996B2Jan 31, 2017

Method for filling trench with metal layer and semiconductor structure formed by using the same

UNITED MICROELECTRONICS CORP0 citations49

HSU CHI-MAO

2 patents

TSAI MIN-CHUAN

1 patent

YANG CHAN-LON

1 patent

LIAO PO-JUI

1 patent

CHENG TSUN-MIN

1 patent

HUANG HSIN-FU

1 patent

HSIEH YA-HSUEH

1 patent