Inventor
TSAI MIN-CHUAN
TW28 patents
⚠️ This page may combine multiple inventors who share the name “TSAI MIN-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
20 patentsUS9679813B2Jun 13, 2017
Semiconductor structure and process for forming plug including layer with pulled back sidewall part
UNITED MICROELECTRONICS CORP9 citations84
US9018086B2Apr 28, 2015
Semiconductor device having a metal gate and fabricating method thereof
UNITED MICROELECTRONICS CORP7 citations84
US8735269B1May 27, 2014
Method for forming semiconductor structure having TiN layer
UNITED MICROELECTRONICS CORP7 citations84
US10199269B2Feb 5, 2019
Conductive structure and method for manufacturing conductive structure
UNITED MICROELECTRONICS CORP6 citations83
US9887158B1Feb 6, 2018
Conductive structure having an entrenched high resistive layer
UNITED MICROELECTRONICS CORP5 citations83
US9755047B2Sep 5, 2017
Semiconductor process and semiconductor device
UNITED MICROELECTRONICS CORP2 citations73
US9735015B1Aug 15, 2017
Fabricating method of semiconductor structure
UNITED MICROELECTRONICS CORP2 citations72
US9640482B1May 2, 2017
Semiconductor device with a contact plug and method of fabricating the same
UNITED MICROELECTRONICS CORP6 citations72
US10199228B2Feb 5, 2019
Manufacturing method of metal gate structure
UNITED MICROELECTRONICS CORP0 citations52
US10068797B2Sep 4, 2018
Semiconductor process for forming plug
UNITED MICROELECTRONICS CORP0 citations52
US9985110B2May 29, 2018
Semiconductor process
UNITED MICROELECTRONICS CORP0 citations52
US9653300B2May 16, 2017
Structure of metal gate structure and manufacturing method of the same
UNITED MICROELECTRONICS CORP0 citations52
US9570348B2Feb 14, 2017
Method of forming contact strucutre
UNITED MICROELECTRONICS CORP1 citations52
US10497617B2Dec 3, 2019
Conductive structure and method for manufacturing conductive structure
UNITED MICROELECTRONICS CORP0 citations51
US10192826B2Jan 29, 2019
Conductive layout structure including high resistive layer
UNITED MICROELECTRONICS CORP0 citations51
US9478628B1Oct 25, 2016
Metal gate forming process
UNITED MICROELECTRONICS CORP1 citations51
US9130032B2Sep 8, 2015
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US9076784B2Jul 7, 2015
Transistor and semiconductor structure
UNITED MICROELECTRONICS CORP0 citations51
US9281374B2Mar 8, 2016
Metal gate structure and fabrication method thereof
UNITED MICROELECTRONICS CORP1 citations50
US9558996B2Jan 31, 2017
Method for filling trench with metal layer and semiconductor structure formed by using the same
UNITED MICROELECTRONICS CORP0 citations49