Inventor
LIN CHING-LING
TW30 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHING-LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
29 patentsUS9209273B1Dec 8, 2015
Method of fabricating metal gate structure
UNITED MICROELECTRONICS CORP59 citations97
US9263392B1Feb 16, 2016
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP25 citations94
US10475709B1Nov 12, 2019
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP16 citations93
US10679903B2Jun 9, 2020
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP4 citations84
US9484263B1Nov 1, 2016
Method of removing a hard mask on a gate
UNITED MICROELECTRONICS CORP8 citations84
US9324610B2Apr 26, 2016
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP9 citations84
US9312356B1Apr 12, 2016
Semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP13 citations84
US9306032B2Apr 5, 2016
Method of forming self-aligned metal gate structure in a replacement gate process using tapered interlayer dielectric
UNITED MICROELECTRONICS CORP14 citations84
US9263540B1Feb 16, 2016
Metal gate structure
UNITED MICROELECTRONICS CORP8 citations84
US9748144B1Aug 29, 2017
Method of fabricating semiconductor device
UNITED MICROELECTRONICS CORP16 citations83
US8951918B2Feb 10, 2015
Method for fabricating patterned structure of semiconductor device
UNITED MICROELECTRONICS CORP9 citations82
US9117886B2Aug 25, 2015
Method for fabricating a semiconductor device by forming and removing a dummy gate structure
UNITED MICROELECTRONICS CORP5 citations73
US12538767B2Jan 27, 2026
Planarization method
UNITED MICROELECTRONICS CORP0 citations62
US12439681B2Oct 7, 2025
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11972984B2Apr 30, 2024
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11569133B2Jan 31, 2023
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US9984974B1May 29, 2018
Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
UNITED MICROELECTRONICS CORP1 citations62
US9466521B2Oct 11, 2016
Semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
UNITED MICROELECTRONICS CORP1 citations62
US9196500B2Nov 24, 2015
Method for manufacturing semiconductor structures
UNITED MICROELECTRONICS CORP2 citations62
US12593493B2Mar 31, 2026
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations61
US10892194B2Jan 12, 2021
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US10204981B2Feb 12, 2019
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations52
US9899322B2Feb 20, 2018
Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
UNITED MICROELECTRONICS CORP0 citations52
US9312121B1Apr 12, 2016
Method for cleaning contact hole and forming contact plug therein
UNITED MICROELECTRONICS CORP1 citations52
US10741455B2Aug 11, 2020
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations51
US10607897B2Mar 31, 2020
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations51
US9281374B2Mar 8, 2016
Metal gate structure and fabrication method thereof
UNITED MICROELECTRONICS CORP1 citations50
US10312146B2Jun 4, 2019
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP0 citations41
US9564371B2Feb 7, 2017
Method for forming semiconductor device
UNITED MICROELECTRONICS CORP0 citations41