Inventor

SEPPALA BRYAN R

US3 patents

⚠️ This page may combine multiple inventors who share the name “SEPPALA BRYAN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CYPRESS SEMICONDUCTOR CORP

1 patent

US5665639ASep 9, 1997

Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal

CYPRESS SEMICONDUCTOR CORP154 citations94

BMC IND INC

1 patent

US4586778AMay 6, 1986

Compliant pin

BMC IND INC30 citations85

HONEYWELL INT INC

1 patent

US7736946B2Jun 15, 2010

System and method for sealing a MEMS device

HONEYWELL INT INC16 citations82