Inventor
MIELE RALPH V
US30 patents
⚠️ This page may combine multiple inventors who share the name “MIELE RALPH V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
29 patentsUS10482689B2Nov 19, 2019
Crowdsourced failure mode prediction
INTEL CORP31 citations91
USD808950SJan 30, 2018
Dual screen notebook computer
INTEL CORP41 citations91
US9483126B2Nov 1, 2016
Smart variable torque display
INTEL CORP6 citations84
US9353560B2May 31, 2016
Smart variable torque display
INTEL CORP7 citations84
US9727092B1Aug 8, 2017
Torque hinge for a computing device
INTEL CORP12 citations82
US10503216B2Dec 10, 2019
Adjustment of magnetic force in a computing device
INTEL CORP8 citations81
US10600138B2Mar 24, 2020
System to monitor utilization of personal protective equipment in restricted areas
INTEL CORP10 citations80
US10455685B1Oct 22, 2019
Electronic device, socket, and spacer to alter socket profile
INTEL CORP12 citations78
US9258914B2Feb 9, 2016
Hinge assembly
INTEL CORP9 citations78
US11449111B2Sep 20, 2022
Scalable, high load, low stiffness, and small footprint loading mechanism
INTEL CORP6 citations73
US10188931B2Jan 29, 2019
Smart baseball first base or home plate
INTEL CORP3 citations72
US11567508B2Jan 31, 2023
Autonomous unmanned vehicles for responding to situations
INTEL CORP3 citations70
US11106250B2Aug 31, 2021
Adjustment of magnetic force in a computing device
INTEL CORP3 citations70
US10990129B2Apr 27, 2021
Convertible dual screen laptop
INTEL CORP6 citations70
US10720783B2Jul 21, 2020
Wireless charging stand
INTEL CORP4 citations69
US12453054B2Oct 21, 2025
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass
INTEL CORP0 citations62
US12315780B2May 27, 2025
Technologies for processor loading mechanisms
INTEL CORP0 citations61
US11387163B2Jul 12, 2022
Scalable debris-free socket loading mechanism
INTEL CORP0 citations61
US11818832B2Nov 14, 2023
Socket load regulation utilizing CPU carriers with shim components
INTEL CORP0 citations60
US12309933B2May 20, 2025
Magnetically secured semiconductor chip package loading assembly
INTEL CORP0 citations59
US12279395B2Apr 15, 2025
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention
INTEL CORP0 citations58
US12131977B2Oct 29, 2024
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US11842943B2Dec 12, 2023
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US11557529B2Jan 17, 2023
Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions
INTEL CORP0 citations58
US12476167B2Nov 18, 2025
Semiconductor chip package thermo-mechanical cooling assembly
INTEL CORP0 citations52
US12309966B2May 20, 2025
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force
INTEL CORP0 citations50
US10885763B2Jan 5, 2021
Sensing technologies in alarm devices
INTEL CORP0 citations50
US10027160B2Jul 17, 2018
Integration of wireless charging coil to a chassis
INTEL CORP0 citations48
US9451716B1Sep 20, 2016
Serviceable chassis for devices
INTEL CORP0 citations48