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Inventor
KANG KEON TEAK
KR
2 patents
Patents
2 patents
US7445962B2
Nov 4, 2008
Stacked integrated circuits package system with dense routability and high thermal conductivity
STATS CHIPPAC LTD
21 citations
89
US8008787B2
Aug 30, 2011
Integrated circuit package system with delamination prevention structure
STATS CHIPPAC LTD
2 citations
59