Inventor
HIRAO AKIRA
JP26 patents
⚠️ This page may combine multiple inventors who share the name “HIRAO AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
11 patentsUS10815396B2Oct 27, 2020
Thermally conductive pressure-sensitive adhesive sheet
NITTO DENKO CORP9 citations82
US11964462B2Apr 23, 2024
Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
NITTO DENKO CORP1 citations70
US9683138B2Jun 20, 2017
Pressure-sensitive adhesive sheet and magnetic disk drive
NITTO DENKO CORP4 citations70
US12441083B2Oct 14, 2025
Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
NITTO DENKO CORP0 citations60
US11623429B2Apr 11, 2023
Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
NITTO DENKO CORP0 citations60
US11434341B2Sep 6, 2022
Resin sheet and adhesive-layer-having resin sheet
NITTO DENKO CORP0 citations60
US10961417B2Mar 30, 2021
Laminate sheet and roll
NITTO DENKO CORP1 citations59
US10329457B2Jun 25, 2019
Conductive pressure-sensitive adhesive tape
NITTO DENKO CORP0 citations50
US12037522B2Jul 16, 2024
Electrical debonding type adhesive sheet, joined body, and debonding method for joined body
NITTO DENKO CORP0 citations49
US10593353B2Mar 17, 2020
Pressure-sensitive adhesive sheet and magnetic disc device
NITTO DENKO CORP0 citations46
US10647891B2May 12, 2020
Pressure-sensitive adhesive sheet and magnetic disc device
NITTO DENKO CORP0 citations42
FUJI ELECTRIC CO LTD
10 patentsUS10867980B2Dec 15, 2020
Semiconductor equipment
FUJI ELECTRIC CO LTD4 citations69
US12588564B2Mar 24, 2026
Semiconductor device
FUJI ELECTRIC CO LTD0 citations62
US12519047B2Jan 6, 2026
Semiconductor device
FUJI ELECTRIC CO LTD0 citations62
US12394681B2Aug 19, 2025
Semiconductor device
FUJI ELECTRIC CO LTD0 citations62
US11521925B2Dec 6, 2022
Semiconductor module
FUJI ELECTRIC CO LTD1 citations62
US12575439B2Mar 10, 2026
Semiconductor device including a sealing member to seal a semiconductor chip, a printed circuit board, and a conductive block
FUJI ELECTRIC CO LTD0 citations52
US11251163B2Feb 15, 2022
Semiconductor device having circuit board interposed between two conductor layers
FUJI ELECTRIC CO LTD0 citations52
US11658231B2May 23, 2023
Semiconductor device
FUJI ELECTRIC CO LTD0 citations51
US11605582B2Mar 14, 2023
Semiconductor device
FUJI ELECTRIC CO LTD0 citations49
US10090222B2Oct 2, 2018
Semiconductor device with heat dissipation and method of making same
FUJI ELECTRIC CO LTD0 citations41