Inventor
IWAI YU
JP40 patents
⚠️ This page may combine multiple inventors who share the name “IWAI YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJIFILM CORP
26 patentsUS10526448B2Jan 7, 2020
Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device
FUJIFILM CORP2 citations73
US10450417B2Oct 22, 2019
Resin, composition, cured film, method for manufacturing cured film and semiconductor device
FUJIFILM CORP3 citations73
US9716025B2Jul 25, 2017
Temporary bonding laminates for use in manufacture of semiconductor devices
FUJIFILM CORP2 citations73
US10580640B2Mar 3, 2020
Kit and laminate
FUJIFILM CORP2 citations72
US10538627B2Jan 21, 2020
Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition
FUJIFILM CORP3 citations72
US9746771B2Aug 29, 2017
Laminate body
FUJIFILM CORP3 citations72
US9601706B2Mar 21, 2017
Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device
FUJIFILM CORP2 citations72
US10096776B2Oct 9, 2018
Method for lithographic patterning of organic layers
FUJIFILM CORP2 citations71
US7935473B2May 3, 2011
Photosensitive composition, lithographic printing plate precursor, lithographic printing method, and novel cyanine dyes
FUJIFILM CORP6 citations63
US11860538B2Jan 2, 2024
Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device
FUJIFILM CORP0 citations62
US11567405B2Jan 31, 2023
Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device
FUJIFILM CORP0 citations62
US11480876B2Oct 25, 2022
Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device
FUJIFILM CORP0 citations58
US7833689B2Nov 16, 2010
Lithographic printing plate precursor and lithographic printing method
FUJIFILM CORP2 citations53
US9966295B2May 8, 2018
Temporary bonding laminates for use in manufacture of semiconductor devices and method for manufacturing semiconductor devices
FUJIFILM CORP1 citations52
US9716024B2Jul 25, 2017
Temporary bonding laminates for used in manufacture of semiconductor devices
FUJIFILM CORP0 citations52
US9177921B2Nov 3, 2015
Manufacturing method of semiconductor device
FUJIFILM CORP1 citations52
US8048607B2Nov 1, 2011
Compound having polymethine-chain structure, image forming material, planographic printing plate precursor, and image forming method using the same, method of making planographic printing plate, and planographic printing method
FUJIFILM CORP1 citations52
US10442961B2Oct 15, 2019
Composition, process for producing sheet, sheet, laminate, and laminate with device wafer
FUJIFILM CORP0 citations51
US10287458B2May 14, 2019
Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film
FUJIFILM CORP0 citations51
US9929376B2Mar 27, 2018
Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor
FUJIFILM CORP0 citations51
US9188868B2Nov 17, 2015
Lithographic printing plate precursors and processes for preparing lithographic printing plates
FUJIFILM CORP1 citations51
US9067400B2Jun 30, 2015
Lithographic printing plate precursor and method of preparing lithographic printing plate
FUJIFILM CORP1 citations50
US10780679B2Sep 22, 2020
Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device
FUJIFILM CORP0 citations42
US9505953B2Nov 29, 2016
Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same
FUJIFILM CORP0 citations41
US9482955B2Nov 1, 2016
Lithographic printing plate precursor and plate making method thereof
FUJIFILM CORP0 citations41
US8637221B2Jan 28, 2014
Lithographic printing plate precursor, plate making method thereof and novel polymer compound
FUJIFILM CORP0 citations41
IWAI YU
5 patentsUS8156621B2Apr 17, 2012
Methods of producing piezoelectric vibrating devices
IWAI YU15 citations83
US8221957B2Jul 17, 2012
Planographic printing plate precursor and printing method using the same
IWAI YU2 citations61
US8722931B2May 13, 2014
Compound and method for preparing the same
IWAI YU0 citations50
US8758975B2Jun 24, 2014
Lithographic printing plate precursor and method of preparing lithographic printing plate
IWAI YU1 citations49
US8642243B2Feb 4, 2014
Polymerizable composition, and lithographic printing plate precursor, antifouling member and antifogging member each using the same
IWAI YU0 citations40
NIHON DEMPA KOGYO CO
3 patentsUS7764145B2Jul 27, 2010
Piezoelectric resonator, method of manufacturing the same and electronic part using the same
NIHON DEMPA KOGYO CO26 citations92
US7902729B2Mar 8, 2011
Piezoelectric vibrating pieces and piezoelectric devices
NIHON DEMPA KOGYO CO7 citations83
US7973458B2Jul 5, 2011
Piezoelectric vibrating pieces having progressively narrowed vibrating arms
NIHON DEMPA KOGYO CO6 citations63