P

Inventor

IWAI YU

JP40 patents
⚠️ This page may combine multiple inventors who share the name “IWAI YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJIFILM CORP

26 patents
US10526448B2Jan 7, 2020

Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device

FUJIFILM CORP2 citations73
US10450417B2Oct 22, 2019

Resin, composition, cured film, method for manufacturing cured film and semiconductor device

FUJIFILM CORP3 citations73
US9716025B2Jul 25, 2017

Temporary bonding laminates for use in manufacture of semiconductor devices

FUJIFILM CORP2 citations73
US10580640B2Mar 3, 2020

Kit and laminate

FUJIFILM CORP2 citations72
US10538627B2Jan 21, 2020

Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

FUJIFILM CORP3 citations72
US9746771B2Aug 29, 2017

Laminate body

FUJIFILM CORP3 citations72
US9601706B2Mar 21, 2017

Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device

FUJIFILM CORP2 citations72
US10096776B2Oct 9, 2018

Method for lithographic patterning of organic layers

FUJIFILM CORP2 citations71
US7935473B2May 3, 2011

Photosensitive composition, lithographic printing plate precursor, lithographic printing method, and novel cyanine dyes

FUJIFILM CORP6 citations63
US11860538B2Jan 2, 2024

Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device

FUJIFILM CORP0 citations62
US11567405B2Jan 31, 2023

Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device

FUJIFILM CORP0 citations62
US11480876B2Oct 25, 2022

Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device

FUJIFILM CORP0 citations58
US7833689B2Nov 16, 2010

Lithographic printing plate precursor and lithographic printing method

FUJIFILM CORP2 citations53
US9966295B2May 8, 2018

Temporary bonding laminates for use in manufacture of semiconductor devices and method for manufacturing semiconductor devices

FUJIFILM CORP1 citations52
US9716024B2Jul 25, 2017

Temporary bonding laminates for used in manufacture of semiconductor devices

FUJIFILM CORP0 citations52
US9177921B2Nov 3, 2015

Manufacturing method of semiconductor device

FUJIFILM CORP1 citations52
US8048607B2Nov 1, 2011

Compound having polymethine-chain structure, image forming material, planographic printing plate precursor, and image forming method using the same, method of making planographic printing plate, and planographic printing method

FUJIFILM CORP1 citations52
US10442961B2Oct 15, 2019

Composition, process for producing sheet, sheet, laminate, and laminate with device wafer

FUJIFILM CORP0 citations51
US10287458B2May 14, 2019

Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film

FUJIFILM CORP0 citations51
US9929376B2Mar 27, 2018

Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor

FUJIFILM CORP0 citations51
US9188868B2Nov 17, 2015

Lithographic printing plate precursors and processes for preparing lithographic printing plates

FUJIFILM CORP1 citations51
US9067400B2Jun 30, 2015

Lithographic printing plate precursor and method of preparing lithographic printing plate

FUJIFILM CORP1 citations50
US10780679B2Sep 22, 2020

Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device

FUJIFILM CORP0 citations42
US9505953B2Nov 29, 2016

Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same

FUJIFILM CORP0 citations41
US9482955B2Nov 1, 2016

Lithographic printing plate precursor and plate making method thereof

FUJIFILM CORP0 citations41
US8637221B2Jan 28, 2014

Lithographic printing plate precursor, plate making method thereof and novel polymer compound

FUJIFILM CORP0 citations41

IWAI YU

5 patents

NIHON DEMPA KOGYO CO

3 patents

OYA TOYOHISA

2 patents

IWAI HIROKI

1 patent

SUZUKI SHOTA

1 patent

AKEBONO BRAKE IND

1 patent

AOSHIMA NORIO

1 patent