Inventor
ZHAO LIE
US4 patents
Patents
4 patentsUS10049921B2Aug 14, 2018
Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor
LAM RES CORP15 citations82
US9768063B1Sep 19, 2017
Dual damascene fill
LAM RES CORP5 citations71
US9490211B1Nov 8, 2016
Copper interconnect
LAM RES CORP2 citations60
US12456621B2Oct 28, 2025
Inert gas implantation for hard mask selectivity improvement
LAM RES CORP0 citations51