Inventor
YU ROY RONGQING
US9 patents
⚠️ This page may combine multiple inventors who share the name “YU ROY RONGQING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS7855455B2Dec 21, 2010
Lock and key through-via method for wafer level 3 D integration and structures produced
IBM35 citations91
US7084479B2Aug 1, 2006
Line level air gaps
IBM27 citations90
US10777454B2Sep 15, 2020
3D integration method using SOI substrates and structures produced thereby
IBM2 citations72
US7994639B2Aug 9, 2011
Microelectronic structure including dual damascene structure and high contrast alignment mark
IBM2 citations56
US10796958B2Oct 6, 2020
3D integration method using SOI substrates and structures produced thereby
IBM0 citations51
US10651086B2May 12, 2020
3D integration method using SOI substrates and structures produced thereby
IBM0 citations51