Inventor
LIN YUEH-TING
TW12 patents
Patents
12 patentsUS11177142B2Nov 16, 2021
Method for dicing integrated fan-out packages without seal rings
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations85
US10672741B2Jun 2, 2020
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10720409B2Jul 21, 2020
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11587900B2Feb 21, 2023
Package structure including IPD and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11088094B2Aug 10, 2021
Air channel formation in packaging process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10867928B2Dec 15, 2020
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12211782B2Jan 28, 2025
Semiconductor package dielectric susbtrate including a trench
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961796B2Apr 16, 2024
Semiconductor package dielectric substrate including a trench
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12159853B2Dec 3, 2024
Package structure including IPD and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11984410B2May 14, 2024
Air channel formation in packaging process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11682637B2Jun 20, 2023
Air channel formation in packaging process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10756037B2Aug 25, 2020
Package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41