Inventor

YEH MING-SHIH

TW64 patents

⚠️ This page may combine multiple inventors who share the name “YEH MING-SHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEH MING-SHIH

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated fan-out packages and methods of forming the same

Package with bridge die for interconnection and method forming same

Package structure, die and method of manufacturing the same

Package structure including a first die and a second die and a bridge die and method of forming the package structure

Method for dicing integrated fan-out packages without seal rings

Package structure and manufacturing method thereof

Multi-stacked package-on-package structures

Multi-stacked package-on-package structures

Semiconductor package and method of manufacturing the same

Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure

Via for semiconductor device connection and methods of forming the same

Redistribution structure for integrated circuit package and method of forming same

Chip package and method of fabricating the same

Raised via for terminal connections on different planes

Semiconductor package and method

Via for semiconductor device connection and methods of forming the same

Semiconductor package and method

Multi-stacked package-on-package structures

PoP device and method of forming the same

Package structure including IPD and method of forming the same

Semiconductor devices and methods of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Raised via for terminal connections on different planes

Semiconductor packages

Via for component electrode connection

Semiconductor package and method

Multi-stacked package-on-package structures

Raised via for terminal connections on different planes

Via for coupling attached component upper electrode to substrate

Via for semiconductor device connection and methods of forming the same

Semiconductor package and method of manufacturing the same

Semiconductor device and method

Methods of manufacturing semiconductor devices

Semiconductor package dielectric susbtrate including a trench

Package structure and manufacturing method thereof

Semiconductor package dielectric substrate including a trench

Semiconductor devices

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Low resistance high reliability contact via and metal line structure for semiconductor device

Method for forming dual damascene structures with tapered via portions and improved performance

MOM capacitors integrated with air-gaps

YU CHEN-HUA

Interconnection structure design for low RC delay and leakage

Methods for improving uniformity of cap layers

SHIH CHIEN-HSUEH

Process for improving copper line cap formation

Process for improving copper line cap formation

TAIWAN SEMICONDCUTOR MFG COMPA

Forming diffusion barriers by annealing copper alloy layers

HSIAO YI-LI

Apparatus for storing substrates