Inventor

MUNRO JEFFREY C

US32 patents

⚠️ This page may combine multiple inventors who share the name “MUNRO JEFFREY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MUNRO JEFFREY C

DOW GLOBAL TECHNOLOGIES LLC

Polymer pi-bond-philic filler composites

Curable compositions comprising unsaturated polyolefins

Curable compositions comprising unsaturated polyolefins

Painted polyolefin articles

Process to produce a polyolefin reactive telechelic pre-polymer, polyolefin reactive telechelic pre-polymers and crosslinked elastomers and high molecular weight elastomers

Mixed catalyst systems for producing multimodal elastomers

Formulation of elastomer copolymer and block copolymer

Thermoplastic polyolefin blends having improved low temperature impact performance

Curable compositions comprising unsaturated polyolefins

Process for preparing crosslinked polyolefin particles

Process to produce polyolefin ionomers and ionomers produced thereby

Catalyst system for multi-block copolymer formation

Synthetic leather

Semi-crystalline thermoplastic block copolymers

Curable compositions comprising telechelic polyolefins

Polyolefin composition

Foam composition with olefin block copolymer gel particles

Foam composition with olefin block copolymer gel particles

Process for the production of polymer compositions with excellent processability

Compositions containing coated polymer particles and TPO compositions formed from the same

High melt flow thermoplastic polyolefins with modifier

Process for degassing crosslinked power cables

Olefin block copolymer composition with low tack

Process to produce a polyolefin reactive telechelic pre-polymer

APPLIED MATERIALS INC

Method for depositing and curing low-k films for gapfill and conformal film applications

Method and system for improving dielectric film quality for void free gap fill

Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes

Post deposition plasma treatment to increase tensile stress of HDP-CVD SIO2

Post deposition plasma treatment to increase tensile stress of HDP-CVD SIO2

Dopant activation in doped semiconductor substrates

WU XIAOSONG

Compositions and articles formed from the same

WEAVER LAURA BAUERLE

Clear graphic cling films