Inventor
QUINLAN BRIAN W
US28 patents
Patents
28 patentsUS7329439B2Feb 12, 2008
UV-curable solvent free compositions and use thereof in ceramic chip defect repair
IBM15 citations80
US9743526B1Aug 22, 2017
Wiring board with stacked embedded capacitors and method of making
IBM8 citations78
US10622299B2Apr 14, 2020
Multi terminal capacitor within input output path of semiconductor package interconnect
IBM1 citations73
US9601423B1Mar 21, 2017
Under die surface mounted electrical elements
IBM4 citations73
US11282773B2Mar 22, 2022
Enlarged conductive pad structures for enhanced chip bond assembly yield
IBM2 citations72
US10756031B1Aug 25, 2020
Decoupling capacitor stiffener
IBM2 citations72
US10586782B2Mar 10, 2020
Lead-free solder joining of electronic structures
IBM2 citations72
US11388821B2Jul 12, 2022
Thin film capacitors for core and adjacent build up layers
IBM0 citations62
US10916507B2Feb 9, 2021
Multiple chip carrier for bridge assembly
IBM0 citations62
US10892249B2Jan 12, 2021
Carrier and integrated memory
IBM0 citations62
US10607928B1Mar 31, 2020
Reduction of laminate failure in integrated circuit (IC) device carrier
IBM1 citations62
US10566275B2Feb 18, 2020
Element place on laminates
IBM1 citations62
US10224269B2Mar 5, 2019
Element place on laminates
IBM1 citations62
US11239183B2Feb 1, 2022
Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
IBM0 citations61
US12504747B2Dec 23, 2025
Multicomponent module design and fabrication
IBM0 citations56
US10224274B2Mar 5, 2019
Multi terminal capacitor within input output path of semiconductor package interconnect
IBM0 citations52
US10224273B2Mar 5, 2019
Multi terminal capacitor within input output path of semiconductor package interconnect
IBM0 citations52
US9899313B2Feb 20, 2018
Multi terminal capacitor within input output path of semiconductor package interconnect
IBM0 citations52
US9640492B1May 2, 2017
Laminate warpage control
IBM1 citations52
US11004614B2May 11, 2021
Stacked capacitors for use in integrated circuit modules and the like
IBM0 citations51
US10957650B2Mar 23, 2021
Bridge support structure
IBM0 citations51
US10840214B2Nov 17, 2020
Carrier and integrated memory
IBM0 citations51
US10660209B2May 19, 2020
Thin film capacitors for core and adjacent build up layers
IBM0 citations51
US10515929B2Dec 24, 2019
Carrier and integrated memory
IBM0 citations51
US10431563B1Oct 1, 2019
Carrier and integrated memory
IBM0 citations51
US11404365B2Aug 2, 2022
Direct attachment of capacitors to flip chip dies
IBM0 citations50
US11121101B2Sep 14, 2021
Flip chip packaging rework
IBM0 citations50
US10770385B2Sep 8, 2020
Connected plane stiffener within integrated circuit chip carrier
IBM0 citations41