Inventor
KIM HAERYONG
KR40 patents
⚠️ This page may combine multiple inventors who share the name “KIM HAERYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
39 patentsUS10079144B2Sep 18, 2018
Composition for layered transition metal chalcogenide compound layer and method of forming layered transition metal chalcogenide compound layer
SAMSUNG ELECTRONICS CO LTD25 citations94
US10790356B2Sep 29, 2020
Semiconductor device including metal-2 dimensional material-semiconductor contact
SAMSUNG ELECTRONICS CO LTD7 citations84
US10217819B2Feb 26, 2019
Semiconductor device including metal-2 dimensional material-semiconductor contact
SAMSUNG ELECTRONICS CO LTD6 citations84
US11342414B2May 24, 2022
Semiconductor device including metal-2 dimensional material-semiconductor contact
SAMSUNG ELECTRONICS CO LTD2 citations73
US10559660B2Feb 11, 2020
Semiconductor device including metal-2 dimensional material-semiconductor contact
SAMSUNG ELECTRONICS CO LTD3 citations73
US9922825B2Mar 20, 2018
Electronics device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printing
SAMSUNG ELECTRONICS CO LTD2 citations73
US11081338B2Aug 3, 2021
Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations70
US12513919B2Dec 30, 2025
Method of manufacturing metal nitride film and electronic device including metal nitride film
SAMSUNG ELECTRONICS CO LTD0 citations62
US12199137B2Jan 14, 2025
Integrated circuit devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12132133B2Oct 29, 2024
Avalanche photodetectors and image sensors including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12040360B2Jul 16, 2024
Semiconductor device including metal-2 dimensional material-semiconductor contact
SAMSUNG ELECTRONICS CO LTD0 citations62
US11810946B2Nov 7, 2023
Integrated circuit device including capacitor with metal nitrate interfacial layer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11804518B2Oct 31, 2023
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11798980B2Oct 24, 2023
Integrated circuit device and electronic device including capacitor with interfacial layer containing metal element, other element, nitrogen, and oxygen
SAMSUNG ELECTRONICS CO LTD0 citations62
US11721781B2Aug 8, 2023
Avalanche photodetectors and image sensors including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11424316B2Aug 23, 2022
Capacitor structure and semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US11424317B2Aug 23, 2022
Method of manufacturing metal nitride film and electronic device including metal nitride film
SAMSUNG ELECTRONICS CO LTD0 citations62
US11417790B2Aug 16, 2022
Avalanche photodetectors and image sensors including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11367799B2Jun 21, 2022
Broadband multi-purpose optical device and methods of manufacturing and operating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11257899B2Feb 22, 2022
Film structure including hafnium oxide, electronic device including the same, and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11018001B2May 25, 2021
Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US11004888B2May 11, 2021
Photoelectric conversion element and optical sensor including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10741389B2Aug 11, 2020
Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US12324145B2Jun 3, 2025
Semiconductor device with capping conductive layer on an electrode and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12034036B2Jul 9, 2024
Semiconductor device and semiconductor apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11967502B2Apr 23, 2024
Methods of forming material layer, semiconductor devices, and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11665884B2May 30, 2023
Semiconductor device with capping conductive layer on an electrode and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11658024B2May 23, 2023
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11728160B2Aug 15, 2023
Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US11985910B2May 14, 2024
Memristor and neuromorphic device comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11600774B2Mar 7, 2023
Nonvolatile memory device and operating method of the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US11374171B2Jun 28, 2022
Memristor and neuromorphic device comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US12268106B2Apr 1, 2025
Nonvolatile memory device and operating method of the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US11024748B2Jun 1, 2021
Nonvolatile memory device including two-dimensional material and apparatus including the nonvolatile memory device
SAMSUNG ELECTRONICS CO LTD0 citations52
US10553730B2Feb 4, 2020
Broadband multi-purpose optical device and methods of manufacturing and operating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10522583B2Dec 31, 2019
Photoelectric conversion element and optical sensor including the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10460935B2Oct 29, 2019
Electronic device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printing
SAMSUNG ELECTRONICS CO LTD0 citations52
US10867784B2Dec 15, 2020
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11784213B2Oct 10, 2023
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations48