P

Inventor

KIM HAERYONG

KR40 patents
⚠️ This page may combine multiple inventors who share the name “KIM HAERYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

39 patents
US10079144B2Sep 18, 2018

Composition for layered transition metal chalcogenide compound layer and method of forming layered transition metal chalcogenide compound layer

SAMSUNG ELECTRONICS CO LTD25 citations94
US10790356B2Sep 29, 2020

Semiconductor device including metal-2 dimensional material-semiconductor contact

SAMSUNG ELECTRONICS CO LTD7 citations84
US10217819B2Feb 26, 2019

Semiconductor device including metal-2 dimensional material-semiconductor contact

SAMSUNG ELECTRONICS CO LTD6 citations84
US11342414B2May 24, 2022

Semiconductor device including metal-2 dimensional material-semiconductor contact

SAMSUNG ELECTRONICS CO LTD2 citations73
US10559660B2Feb 11, 2020

Semiconductor device including metal-2 dimensional material-semiconductor contact

SAMSUNG ELECTRONICS CO LTD3 citations73
US9922825B2Mar 20, 2018

Electronics device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printing

SAMSUNG ELECTRONICS CO LTD2 citations73
US11081338B2Aug 3, 2021

Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations70
US12513919B2Dec 30, 2025

Method of manufacturing metal nitride film and electronic device including metal nitride film

SAMSUNG ELECTRONICS CO LTD0 citations62
US12199137B2Jan 14, 2025

Integrated circuit devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12132133B2Oct 29, 2024

Avalanche photodetectors and image sensors including the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12040360B2Jul 16, 2024

Semiconductor device including metal-2 dimensional material-semiconductor contact

SAMSUNG ELECTRONICS CO LTD0 citations62
US11810946B2Nov 7, 2023

Integrated circuit device including capacitor with metal nitrate interfacial layer

SAMSUNG ELECTRONICS CO LTD0 citations62
US11804518B2Oct 31, 2023

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11798980B2Oct 24, 2023

Integrated circuit device and electronic device including capacitor with interfacial layer containing metal element, other element, nitrogen, and oxygen

SAMSUNG ELECTRONICS CO LTD0 citations62
US11721781B2Aug 8, 2023

Avalanche photodetectors and image sensors including the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11424316B2Aug 23, 2022

Capacitor structure and semiconductor device including the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US11424317B2Aug 23, 2022

Method of manufacturing metal nitride film and electronic device including metal nitride film

SAMSUNG ELECTRONICS CO LTD0 citations62
US11417790B2Aug 16, 2022

Avalanche photodetectors and image sensors including the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11367799B2Jun 21, 2022

Broadband multi-purpose optical device and methods of manufacturing and operating the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11257899B2Feb 22, 2022

Film structure including hafnium oxide, electronic device including the same, and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11018001B2May 25, 2021

Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US11004888B2May 11, 2021

Photoelectric conversion element and optical sensor including the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US10741389B2Aug 11, 2020

Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US12324145B2Jun 3, 2025

Semiconductor device with capping conductive layer on an electrode and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US12034036B2Jul 9, 2024

Semiconductor device and semiconductor apparatus including the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US11967502B2Apr 23, 2024

Methods of forming material layer, semiconductor devices, and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US11665884B2May 30, 2023

Semiconductor device with capping conductive layer on an electrode and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US11658024B2May 23, 2023

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US11728160B2Aug 15, 2023

Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations60
US11985910B2May 14, 2024

Memristor and neuromorphic device comprising the same

SAMSUNG ELECTRONICS CO LTD0 citations58
US11600774B2Mar 7, 2023

Nonvolatile memory device and operating method of the same

SAMSUNG ELECTRONICS CO LTD0 citations58
US11374171B2Jun 28, 2022

Memristor and neuromorphic device comprising the same

SAMSUNG ELECTRONICS CO LTD0 citations58
US12268106B2Apr 1, 2025

Nonvolatile memory device and operating method of the same

SAMSUNG ELECTRONICS CO LTD0 citations57
US11024748B2Jun 1, 2021

Nonvolatile memory device including two-dimensional material and apparatus including the nonvolatile memory device

SAMSUNG ELECTRONICS CO LTD0 citations52
US10553730B2Feb 4, 2020

Broadband multi-purpose optical device and methods of manufacturing and operating the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US10522583B2Dec 31, 2019

Photoelectric conversion element and optical sensor including the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US10460935B2Oct 29, 2019

Electronic device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printing

SAMSUNG ELECTRONICS CO LTD0 citations52
US10867784B2Dec 15, 2020

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations50
US11784213B2Oct 10, 2023

Integrated circuit device

SAMSUNG ELECTRONICS CO LTD0 citations48

LG ELECTRONICS INC

1 patent