P

Inventor

IJI MASATOSHI

JP56 patents
⚠️ This page may combine multiple inventors who share the name “IJI MASATOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

29 patents
US5715592AFeb 10, 1998

Parts disassembling apparatus

NEC CORP68 citations94
US7445835B2Nov 4, 2008

Kenaf-fiber-reinforced resin composition

NEC CORP27 citations92
US6284824B1Sep 4, 2001

Flame retardant polycarbonate resin compositions

NEC CORP19 citations92
US5780536AJul 14, 1998

Joining member and method for disintegrating joined structure

NEC CORP39 citations92
US5743936AApr 28, 1998

Method of recovering valuables from printed wiring board having electronic components mounted thereon

NEC CORP25 citations92
US5676318AOct 14, 1997

Method of recovering valuable substances from printed circuit board

NEC CORP24 citations92
US6730402B2May 4, 2004

Flame-retardant epoxy resin composition and laminate made with the same

NEC CORP17 citations83
US6001921ADec 14, 1999

Flame retardant resin composition

NEC CORP11 citations73
US5801358ASep 1, 1998

Method for disintegrating joined structure with high frequency fields

NEC CORP5 citations73
US10934368B2Mar 2, 2021

Cellulose resin, material for molding, molded body and process for producing cellulose resin

NEC CORP4 citations72
US6392003B1May 21, 2002

Phenol condensate from phenols, aromatic compound and N-containing heterocyclic

NEC CORP9 citations72
US9382335B2Jul 5, 2016

Process for producing cellulose derivative and cellulose derivative

NEC CORP5 citations71
US6290919B1Sep 18, 2001

Electrostatic separating apparatus

NEC CORP10 citations70
US6156865ADec 5, 2000

Flame retardant thermosetting resin composition

NEC CORP5 citations63
US12570769B2Mar 10, 2026

Paramylon-based resin, molding material, molded body, and production method for paramylon-based resin

NEC CORP0 citations62
US7723460B2May 25, 2010

Shape-memory resin performing remoldability and excellent in shape recovering property, and molded product composed of the cross-linked resin

NEC CORP6 citations62
US11591410B2Feb 28, 2023

Cellulose derivative and resin composition for molding

NEC CORP0 citations61
US11028186B2Jun 8, 2021

Cellulose derivative, cellulose resin composition, molded body and product using same

NEC CORP0 citations61
US10982009B2Apr 20, 2021

Cellulose derivative and use thereof

NEC CORP0 citations61
US11505681B2Nov 22, 2022

Cellulose resin composition, molded body and product using same

NEC CORP0 citations59
US7790069B2Sep 7, 2010

Flame-retardant thermoplastic resin composition

NEC CORP3 citations59
US10941282B2Mar 9, 2021

Cellulose resin composition, molded body and product using same

NEC CORP1 citations57
US11149133B2Oct 19, 2021

Cellulose resin composition, molded body and product using same

NEC CORP0 citations51
US10005849B2Jun 26, 2018

Process for producing cellulose derivative and cellulose derivative

NEC CORP1 citations51
US11161917B2Nov 2, 2021

Method for producing cellulose derivative, and cellulose derivative

NEC CORP0 citations50
US10961388B2Mar 30, 2021

Polylactic acid resin composition and polyester resin composition, and method for producing the same and molded body thereof

NEC CORP0 citations50
US12522671B2Jan 13, 2026

Paramylon-based resin, molding material, molded body, and method for producing paramylon-based resin

NEC CORP0 citations49
US7799852B2Sep 21, 2010

Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler

NEC CORP1 citations49
US11434350B2Sep 6, 2022

Cellulose resin composition, molded body and product using same, and a method for producing cellulose resin composition

NEC CORP0 citations48

TANAKA SHUKICHI

5 patents

IJI MASATOSHI

3 patents

SUMITOMO BAKELITE CO

2 patents

SUMITOMO DOW LTD

2 patents

KIUCHI YUKIHIRO

2 patents

SUMITOMO CHEMICAL CO

1 patent

DENKI KAGAKU KOGYO KK

1 patent

INOUE KAZUHIKO

1 patent

SOYAMA MAKOTO

1 patent

SERIZAWA SHIN

1 patent

KISHIMOTO HIROAKI

1 patent

SHIMURA MIDORI

1 patent

Showing the top 50 of 56 patents by PatentIndex Score.