Inventor

WAH CHOONG L

SG2 patents

Patents

2 patents

US6617201B2Sep 9, 2003

U-shape tape for BOC FBGA package to improve moldability

MICRON TECHNOLOGY INC11 citations65

US6486536B1Nov 26, 2002

U-shape tape for BOC FBGA package to improve moldability

MICRON TECHNOLOGY INC8 citations65