Inventor
PRIEWASSER KARL HEINZ
DE46 patents
⚠️ This page may combine multiple inventors who share the name “PRIEWASSER KARL HEINZ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
40 patentsUS7115485B2Oct 3, 2006
Method for processing wafer
DISCO CORP20 citations92
US9595463B2Mar 14, 2017
Wafer processing method
DISCO CORP7 citations84
US7520309B2Apr 21, 2009
Method for adhering protecting tape of wafer and adhering apparatus
DISCO CORP11 citations84
US11201126B2Dec 14, 2021
Method of producing a substrate and system for producing a substrate
DISCO CORP4 citations73
US10784164B2Sep 22, 2020
Method of dividing wafer
DISCO CORP4 citations73
US10312099B2Jun 4, 2019
Wafer processing method
DISCO CORP4 citations73
US10242913B2Mar 26, 2019
Method of processing a wafer and wafer processing system
DISCO CORP3 citations73
US10032669B2Jul 24, 2018
Wafer dividing method
DISCO CORP3 citations73
US9397000B2Jul 19, 2016
Wafer processing method
DISCO CORP3 citations73
US11133219B2Sep 28, 2021
Method of processing a wafer
DISCO CORP2 citations72
US11011406B2May 18, 2021
Method of processing a substrate
DISCO CORP2 citations70
US10727128B2Jul 28, 2020
Method of processing a wafer
DISCO CORP3 citations70
US9472442B2Oct 18, 2016
Wafer processing method
DISCO CORP2 citations63
US7708855B2May 4, 2010
Method for processing a semiconductor wafer
DISCO CORP4 citations63
US7413501B2Aug 19, 2008
Method for concave grinding of wafer and unevenness-absorbing pad
DISCO CORP5 citations63
US12472581B2Nov 18, 2025
Method of processing a substrate and system for processing a substrate
DISCO CORP0 citations62
US12062533B2Aug 13, 2024
Method of producing a substrate and system for producing a substrate
DISCO CORP1 citations62
US11784138B2Oct 10, 2023
Wafer processing with a protective film and peripheral adhesive
DISCO CORP0 citations62
US11637074B2Apr 25, 2023
Method of processing wafer
DISCO CORP0 citations62
US11626324B2Apr 11, 2023
Method of processing a wafer
DISCO CORP0 citations62
US10727127B2Jul 28, 2020
Method of processing a substrate
DISCO CORP1 citations61
US11424161B2Aug 23, 2022
Substrate processing method
DISCO CORP0 citations58
US10475676B2Nov 12, 2019
Workpiece processing method
DISCO CORP1 citations56
US12094751B2Sep 17, 2024
Method of processing a substrate
DISCO CORP0 citations52
US11823941B2Nov 21, 2023
Method of processing a substrate
DISCO CORP0 citations52
US11676833B2Jun 13, 2023
Protective sheet for use in processing wafer, handling system for wafer, and combination of wafer and protective sheeting
DISCO CORP0 citations52
US10991612B2Apr 27, 2021
Method of processing wafer having protrusions on the back side
DISCO CORP0 citations52
US9768049B2Sep 19, 2017
Support plate and method for forming support plate
DISCO CORP1 citations52
US9704749B2Jul 11, 2017
Method of dividing wafer into dies
DISCO CORP0 citations52
US11894271B2Feb 6, 2024
Method of processing wafer
DISCO CORP0 citations50
US11559974B2Jan 24, 2023
Microfluidic system or device and method of manufacturing a microfluidic system or device
DISCO CORP0 citations50
US9831128B2Nov 28, 2017
Method of processing a substrate
DISCO CORP0 citations50
US12312512B2May 27, 2025
Adhesive sheet for backgrinding and production method for semiconductor wafer
DISCO CORP0 citations49
US12243766B2Mar 4, 2025
Back grinding adhesive sheet, and method for manufacturing semiconductor wafer
DISCO CORP0 citations49
US12224207B2Feb 11, 2025
Method of processing a workpiece and system for processing a workpiece
DISCO CORP0 citations48
US10991623B2Apr 27, 2021
Wafer processing method
DISCO CORP0 citations45
US10682728B2Jun 16, 2020
Method of processing a substrate
DISCO CORP0 citations42
US10256148B2Apr 9, 2019
Method of processing wafer
DISCO CORP0 citations42
US9006085B2Apr 14, 2015
Adhesive and protective member used in a wafer processing method
DISCO CORP0 citations42
US10702946B2Jul 7, 2020
Substrate processing method
DISCO CORP0 citations40
DISCO HI TEC EUROPE GMBH
3 patentsUS11469120B2Oct 11, 2022
Device and method for attaching protective tape to semiconductor wafer
DISCO HI TEC EUROPE GMBH2 citations67
US12211723B2Jan 28, 2025
Alignment device and alignment method
DISCO HI TEC EUROPE GMBH0 citations51
US11935768B2Mar 19, 2024
Device and method for attaching protective tape on semiconductor wafer
DISCO HI TEC EUROPE GMBH0 citations46
PRIEWASSER KARL HEINZ
2 patentsUS9905453B2Feb 27, 2018
Protective sheeting for use in processing a semiconductor-sized wafer and semiconductor-sized wafer processing method
PRIEWASSER KARL HEINZ3 citations69
US11437275B2Sep 6, 2022
Method of processing wafer and protective sheeting for use in this method
PRIEWASSER KARL HEINZ0 citations48