Inventor
LEE MICHAEL GUANG-TZONG
US4 patents
Patents
4 patentsUS6187652B1Feb 13, 2001
Method of fabrication of multiple-layer high density substrate
FUJITSU LTD177 citations98
US6050832AApr 18, 2000
Chip and board stress relief interposer
FUJITSU LTD221 citations98
US6163957ADec 26, 2000
Multilayer laminated substrates with high density interconnects and methods of making the same
FUJITSU LTD138 citations95
US6428942B1Aug 6, 2002
Multilayer circuit structure build up method
FUJITSU LTD32 citations91