P

Inventor

SAYAMA HIROKAZU

JP48 patents
⚠️ This page may combine multiple inventors who share the name “SAYAMA HIROKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RENESAS ELECTRONICS CORP

21 patents
US8372747B2Feb 12, 2013

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP8 citations92
US7960281B2Jun 14, 2011

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP15 citations92
US9614081B2Apr 4, 2017

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP3 citations84
US9412867B2Aug 9, 2016

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP3 citations84
US9209191B2Dec 8, 2015

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP5 citations84
US8809186B2Aug 19, 2014

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP6 citations84
US8586475B2Nov 19, 2013

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP7 citations84
US8541272B2Sep 24, 2013

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS ELECTRONICS CORP1 citations63
US12198987B2Jan 14, 2025

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP0 citations62
US11798886B2Oct 24, 2023

Semiconductor device and method of manufacturing the same

RENESAS ELECTRONICS CORP0 citations62
US11502036B2Nov 15, 2022

Semiconductor device and method of manufacturing the same

RENESAS ELECTRONICS CORP1 citations62
US12288760B2Apr 29, 2025

Semiconductor device

RENESAS ELECTRONICS CORP0 citations52
US9847417B2Dec 19, 2017

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS ELECTRONICS CORP0 citations52
US9349816B2May 24, 2016

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS ELECTRONICS CORP0 citations52
US9214464B2Dec 15, 2015

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS ELECTRONICS CORP0 citations52
US9112013B2Aug 18, 2015

Semiconductor device and method for producing the same

RENESAS ELECTRONICS CORP0 citations52
US8987081B2Mar 24, 2015

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS ELECTRONICS CORP0 citations52
US8859360B2Oct 14, 2014

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS ELECTRONICS CORP0 citations52
US8642418B2Feb 4, 2014

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS ELECTRONICS CORP0 citations52
US7998802B2Aug 16, 2011

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS ELECTRONICS CORP0 citations52
US8742497B2Jun 3, 2014

Semiconductor device

RENESAS ELECTRONICS CORP0 citations42

RENESAS TECH CORP

14 patents
US6906393B2Jun 14, 2005

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS TECH CORP56 citations97
US7470618B2Dec 30, 2008

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS TECH CORP29 citations96
US7183204B2Feb 27, 2007

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same

RENESAS TECH CORP24 citations96
US6740939B2May 25, 2004

Semiconductor device and manufacturing method thereof

RENESAS TECH CORP61 citations96
US7563663B2Jul 21, 2009

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS TECH CORP9 citations93
US7531402B2May 12, 2009

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS TECH CORP18 citations93
US7220637B2May 22, 2007

Method of manufacturing semiconductor device with offset sidewall structure

RENESAS TECH CORP20 citations93
US6872642B2Mar 29, 2005

Manufacturing method of semiconductor device

RENESAS TECH CORP23 citations92
US7109553B2Sep 19, 2006

Semiconductor device and method of manufacturing same

RENESAS TECH CORP14 citations84
US6806537B2Oct 19, 2004

Semiconductor device having offset insulation film formed on insulation film, and method of manufacturing the same

RENESAS TECH CORP13 citations84
US7015107B2Mar 21, 2006

Method of manufacturing semiconductor device

RENESAS TECH CORP10 citations74
US6835610B2Dec 28, 2004

Method of manufacturing semiconductor device having gate electrode with expanded upper portion

RENESAS TECH CORP8 citations74
US6670277B2Dec 30, 2003

Method of manufacturing semiconductor device

RENESAS TECH CORP3 citations63
US6667206B2Dec 23, 2003

Method of manufacturing semiconductor device

RENESAS TECH CORP3 citations63

MITSUBISHI ELECTRIC CORP

11 patents

SAYAMA HIROKAZU

1 patent

OTA KAZUNOBU

1 patent