Inventor
CHO SUNGDONG
KR17 patents
⚠️ This page may combine multiple inventors who share the name “CHO SUNGDONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
15 patentsUS11735498B2Aug 22, 2023
Through via electrode and device isolation structure including oxide layer pattern and nitride layer pattern sequentially stacked on inner surface of trench
SAMSUNG ELECTRONICS CO LTD4 citations72
US11380606B2Jul 5, 2022
Semiconductor device including via structure with head and body portions
SAMSUNG ELECTRONICS CO LTD3 citations69
US12582011B2Mar 17, 2026
Device including first structure having peripheral circuit and second structure having gate layers
SAMSUNG ELECTRONICS CO LTD0 citations61
US11990450B2May 21, 2024
Device including first structure having peripheral circuit and second structure having gate layers
SAMSUNG ELECTRONICS CO LTD0 citations61
US11848285B2Dec 19, 2023
Semiconductor chip including buried dielectric pattern at edge region, semiconductor package including the same, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11791242B2Oct 17, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations60
US12334438B2Jun 17, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US11798866B2Oct 24, 2023
Semiconductor device including via structures with undercut portions and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US12183680B2Dec 31, 2024
Semiconductor memory device including wiring contact plugs
SAMSUNG ELECTRONICS CO LTD0 citations58
US11901297B2Feb 13, 2024
Semiconductor memory device including wiring contact plugs
SAMSUNG ELECTRONICS CO LTD0 citations58
US11569171B2Jan 31, 2023
Semiconductor memory device including wiring contact plugs
SAMSUNG ELECTRONICS CO LTD0 citations58
US12557639B2Feb 17, 2026
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations50
US12500189B2Dec 16, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12176245B2Dec 24, 2024
Semiconductor chip structure
SAMSUNG ELECTRONICS CO LTD0 citations50
US11705379B2Jul 18, 2023
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations46