Inventor

KUSHIDA KEISUKE

JP4 patents

⚠️ This page may combine multiple inventors who share the name “KUSHIDA KEISUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

3 patents

US10940674B2Mar 9, 2021

Resin varnish, prepreg, laminate, and printed wiring board

HITACHI CHEMICAL CO LTD0 citations56

US12258468B2Mar 25, 2025

Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package

HITACHI CHEMICAL CO LTD0 citations48

US11136454B2Oct 5, 2021

Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board

HITACHI CHEMICAL CO LTD0 citations45

SHOWA DENKO MATERIALS CO LTD

1 patent

US11691389B2Jul 4, 2023

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

SHOWA DENKO MATERIALS CO LTD0 citations45