P

Inventor

HSU YUAN-HUNG

TW24 patents
⚠️ This page may combine multiple inventors who share the name “HSU YUAN-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

17 patents
US11482470B2Oct 25, 2022

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations73
US10863626B1Dec 8, 2020

Electronic package carrier structure thereof, and method for fabricating the carrier structure

SILICONWARE PRECISION INDUSTRIES CO LTD3 citations73
US11532528B2Dec 20, 2022

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD3 citations72
US11610850B2Mar 21, 2023

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD3 citations71
US12027484B2Jul 2, 2024

Electronic package and carrier thereof and method for manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations70
US12205906B2Jan 21, 2025

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12100642B2Sep 24, 2024

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11881459B2Jan 23, 2024

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11792938B2Oct 17, 2023

Method for fabricating carrier structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11410954B2Aug 9, 2022

Electronic package, manufacturing method thereof and conductive structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12107055B2Oct 1, 2024

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US12255165B2Mar 18, 2025

Electronic package and carrier thereof and method for manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11069661B1Jul 20, 2021

Electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations59
US12500159B2Dec 16, 2025

Electronic package having multi-chip package structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55
US11742296B2Aug 29, 2023

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US11102890B2Aug 24, 2021

Electronic package and method for manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US11516925B2Nov 29, 2022

Package stack structure and method for manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49

MEGAPRO BIOMEDICAL CO LTD

3 patents

HSIEH MING-FA

1 patent

TATUNG CO

1 patent

IND TECH RES INST

1 patent

HSU YUAN-HUNG

1 patent