Inventor
HSU YUAN-HUNG
TW24 patents
⚠️ This page may combine multiple inventors who share the name “HSU YUAN-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
17 patentsUS11482470B2Oct 25, 2022
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations73
US10863626B1Dec 8, 2020
Electronic package carrier structure thereof, and method for fabricating the carrier structure
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations73
US11532528B2Dec 20, 2022
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations72
US11610850B2Mar 21, 2023
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations71
US12027484B2Jul 2, 2024
Electronic package and carrier thereof and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations70
US12205906B2Jan 21, 2025
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12100642B2Sep 24, 2024
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11881459B2Jan 23, 2024
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11792938B2Oct 17, 2023
Method for fabricating carrier structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11410954B2Aug 9, 2022
Electronic package, manufacturing method thereof and conductive structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12107055B2Oct 1, 2024
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US12255165B2Mar 18, 2025
Electronic package and carrier thereof and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11069661B1Jul 20, 2021
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations59
US12500159B2Dec 16, 2025
Electronic package having multi-chip package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55
US11742296B2Aug 29, 2023
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US11102890B2Aug 24, 2021
Electronic package and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US11516925B2Nov 29, 2022
Package stack structure and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
MEGAPRO BIOMEDICAL CO LTD
3 patentsUS11541007B2Jan 3, 2023
Pharmaceutical compositions containing mixed polymeric micelles
MEGAPRO BIOMEDICAL CO LTD2 citations66
US12268756B2Apr 8, 2025
Biocompatible magnetic materials
MEGAPRO BIOMEDICAL CO LTD0 citations57
US11931456B2Mar 19, 2024
Pharmaceutical compositions containing mixed polymeric micelles
MEGAPRO BIOMEDICAL CO LTD0 citations55