Inventor
JIANG DON-SON
TW16 patents
⚠️ This page may combine multiple inventors who share the name “JIANG DON-SON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
15 patentsUS11764188B2Sep 19, 2023
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations84
US11532528B2Dec 20, 2022
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations72
US11610850B2Mar 21, 2023
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations71
US12027484B2Jul 2, 2024
Electronic package and carrier thereof and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations70
US12255182B2Mar 18, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations62
US11398429B2Jul 26, 2022
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12107055B2Oct 1, 2024
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US12255165B2Mar 18, 2025
Electronic package and carrier thereof and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12500159B2Dec 16, 2025
Electronic package having multi-chip package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55
US9673140B2Jun 6, 2017
Package structure having a laminated release layer and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US11742296B2Aug 29, 2023
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10115712B2Oct 30, 2018
Electronic module
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US10163662B2Dec 25, 2018
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
US9646921B2May 9, 2017
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations48
US12159821B2Dec 3, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47