Inventor
KAWASAKI HIROYOSHI
JP51 patents
⚠️ This page may combine multiple inventors who share the name “KAWASAKI HIROYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SENJU METAL INDUSTRY CO
49 patentsUS9668358B2May 30, 2017
Cu ball
SENJU METAL INDUSTRY CO7 citations83
US10675719B2Jun 9, 2020
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
SENJU METAL INDUSTRY CO3 citations73
US10556299B2Feb 11, 2020
Flux and resin composition for flux
SENJU METAL INDUSTRY CO4 citations73
US10137535B2Nov 27, 2018
Cu ball, Cu core ball, solder joint, solder paste, and solder foam
SENJU METAL INDUSTRY CO3 citations73
US9278409B2Mar 8, 2016
Core ball, solder paste, formed-solder, flux-coated core ball and solder joint
SENJU METAL INDUSTRY CO3 citations73
US11377715B2Jul 5, 2022
Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit
SENJU METAL INDUSTRY CO2 citations72
US10857630B2Dec 8, 2020
Flux and solder paste
SENJU METAL INDUSTRY CO3 citations71
US10639749B2May 5, 2020
Cu core ball, solder joint, solder paste and formed solder
SENJU METAL INDUSTRY CO2 citations71
US11292089B2Apr 5, 2022
Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux
SENJU METAL INDUSTRY CO2 citations70
US10688603B2Jun 23, 2020
Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder, and flux coated solder
SENJU METAL INDUSTRY CO2 citations68
US11590614B2Feb 28, 2023
Flux and solder paste
SENJU METAL INDUSTRY CO2 citations67
US11819955B2Nov 21, 2023
Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device
SENJU METAL INDUSTRY CO1 citations62
US11185950B2Nov 30, 2021
Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder paste, formed solder, and method for manufacturing Cu ball
SENJU METAL INDUSTRY CO0 citations62
US11130202B2Sep 28, 2021
Flux, and solder paste
SENJU METAL INDUSTRY CO1 citations62
US10717157B2Jul 21, 2020
Solder material, solder paste, solder preform, solder joint and method of managing the solder material
SENJU METAL INDUSTRY CO1 citations62
US11583959B2Feb 21, 2023
Solder alloy, solder power, and solder joint
SENJU METAL INDUSTRY CO0 citations61
US11344976B2May 31, 2022
Solder material, solder paste, and solder joint
SENJU METAL INDUSTRY CO1 citations61
US10888957B2Jan 12, 2021
Soldering material
SENJU METAL INDUSTRY CO1 citations61
US10381319B2Aug 13, 2019
Core material, semiconductor package, and forming method of bump electrode
SENJU METAL INDUSTRY CO1 citations61
US11203087B2Dec 21, 2021
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations60
US10888959B2Jan 12, 2021
Cu core ball, solder joint, solder paste and formed solder
SENJU METAL INDUSTRY CO0 citations60
US10357852B2Jul 23, 2019
Flux with dibasic acid mixture
SENJU METAL INDUSTRY CO1 citations60
US10780531B2Sep 22, 2020
Solder ball, solder joint, and joining method
SENJU METAL INDUSTRY CO1 citations59
US10583533B2Mar 10, 2020
Flux
SENJU METAL INDUSTRY CO1 citations59
US11407068B2Aug 9, 2022
Flux composition, solder paste, solder joint and solder joining method
SENJU METAL INDUSTRY CO0 citations58
US11648631B2May 16, 2023
Flux for resin flux cored solder, resin flux cored solder, flux for flux-coated solder, flux-coated solder, and soldering method
SENJU METAL INDUSTRY CO0 citations57
US11376694B2Jul 5, 2022
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations57
US10987764B2Apr 27, 2021
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations57
US11833620B2Dec 5, 2023
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations53
US10370771B2Aug 6, 2019
Method of manufacturing cu core ball
SENJU METAL INDUSTRY CO0 citations52
US10150185B2Dec 11, 2018
Method for producing metal ball, joining material, and metal ball
SENJU METAL INDUSTRY CO0 citations52
US12194573B2Jan 14, 2025
Solder paste
SENJU METAL INDUSTRY CO0 citations51
US11813686B2Nov 14, 2023
Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate
SENJU METAL INDUSTRY CO0 citations51
US11772208B2Oct 3, 2023
Resin composition and soldering flux
SENJU METAL INDUSTRY CO0 citations51
US11571770B2Feb 7, 2023
Solder alloy, solder paste, solder ball, solder preform, and solder joint
SENJU METAL INDUSTRY CO0 citations51
US10811376B2Oct 20, 2020
Cu column, Cu core column, solder joint, and through-silicon via
SENJU METAL INDUSTRY CO0 citations51
US10173287B2Jan 8, 2019
Solder material, solder joint, and method of manufacturing the solder material
SENJU METAL INDUSTRY CO0 citations51
US11571772B2Feb 7, 2023
Flux
SENJU METAL INDUSTRY CO0 citations50
US10147695B2Dec 4, 2018
Cu core ball
SENJU METAL INDUSTRY CO1 citations50
US9816160B2Nov 14, 2017
Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste
SENJU METAL INDUSTRY CO1 citations50
US9266196B2Feb 23, 2016
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste
SENJU METAL INDUSTRY CO1 citations50
US12544862B2Feb 10, 2026
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations49
US11826860B2Nov 28, 2023
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations49
US10843298B2Nov 24, 2020
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations49
US9802251B2Oct 31, 2017
Ni ball, Ni core ball, solder joint, solder paste, and solder foam
SENJU METAL INDUSTRY CO0 citations49
US11413711B2Aug 16, 2022
Flux, resin flux cored solder, and flux coated pellet
SENJU METAL INDUSTRY CO0 citations48
US11179813B2Nov 23, 2021
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations48
US12172243B2Dec 24, 2024
Flux, resin flux cored solder using the flux, and soldering method
SENJU METAL INDUSTRY CO0 citations47
US11305385B2Apr 19, 2022
Flux
SENJU METAL INDUSTRY CO0 citations46
OKI ELECTRIC IND CO LTD
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