Inventor
Ding Wen-Bo
SG3 patents
Patents
3 patentsUS10580823B2Mar 3, 2020
Wafer level packaging method
UNITED MICROELECTRONICS CORP21 citations90
US9852912B1Dec 26, 2017
Method of manufacturing semiconductor device for reducing grain size of polysilicon
UNITED MICROELECTRONICS CORP2 citations70
US10622253B2Apr 14, 2020
Manufacturing method of semiconductor device
UNITED MICROELECTRONICS CORP0 citations44