P

Inventor

HUANG WEN-SHEH

TW32 patents
⚠️ This page may combine multiple inventors who share the name “HUANG WEN-SHEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US11217482B2Jan 4, 2022

Method for forming semiconductor device with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10515852B2Dec 24, 2019

Structure and formation method of semiconductor device with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11404369B2Aug 2, 2022

Semiconductor device structure with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10985011B2Apr 20, 2021

Structure and formation method of semiconductor device with resistive elements

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US10304772B2May 28, 2019

Semiconductor device structure with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11942390B2Mar 26, 2024

Thermal dissipation in semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11798848B2Oct 24, 2023

Semiconductor device structure with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11355410B2Jun 7, 2022

Thermal dissipation in semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12347770B2Jul 1, 2025

One-time-programmable device structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12543566B2Feb 3, 2026

Semiconductor devices and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12451401B2Oct 21, 2025

Thermal dissipation in semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12165947B2Dec 10, 2024

Semiconductor devices and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12119262B2Oct 15, 2024

Semiconductor device structure with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040178B2Jul 16, 2024

Method for manufacturing semiconductor structure with resistive elements

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901289B2Feb 13, 2024

Semiconductor device structure with resistive element

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670501B2Jun 6, 2023

Semiconductor device structure with resistive elements

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12159830B2Dec 3, 2024

Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11923295B2Mar 5, 2024

Interconnect level with high resistance layer and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12575409B2Mar 10, 2026

Interconnect level with high resistance layer and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12074107B2Aug 27, 2024

Structure and method of forming a semiconductor device with resistive elements

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12068377B2Aug 20, 2024

Back-end-of-line devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11799001B2Oct 24, 2023

Back-end-of-line devices

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11437313B2Sep 6, 2022

Structure and method of forming a semiconductor device with resistive elements

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10164002B2Dec 25, 2018

Semiconductor device and layout method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US11532548B2Dec 20, 2022

Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12417955B2Sep 16, 2025

Thermal sensor device by back end of line metal resistor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49

TAIWAN SEMICONDUCTOR MFG

2 patents

TSAI CHUN HSIUNG

1 patent

Yu de-wei

1 patent

CHO HSIU-YING

1 patent

LIN CHIA-PIN

1 patent