Inventor

LOCK KOK CHUEN

CN2 patents

Patents

2 patents

US11227818B2Jan 18, 2022

Stacked dies electrically connected to a package substrate by lead terminals

UTAC HEADQUARTERS PTE LTD1 citations57

US11901308B2Feb 13, 2024

Semiconductor packages with integrated shielding

UTAC HEADQUARTERS PTE LTD0 citations45