Inventor

WONG WILL K

US3 patents

⚠️ This page may combine multiple inventors who share the name “WONG WILL K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PODDAR ANINDYA

1 patent

US8450151B1May 28, 2013

Micro surface mount device packaging

PODDAR ANINDYA13 citations81

WONG WILL K

1 patent

US8298871B2Oct 30, 2012

Method and leadframe for packaging integrated circuits

WONG WILL K2 citations52

NAT SEMICONDUCTOR CORP

1 patent

US8377267B2Feb 19, 2013

Foil plating for semiconductor packaging

NAT SEMICONDUCTOR CORP0 citations49