Inventor
LEE JAYEON
KR4 patents
Patents
4 patentsUS11923343B2Mar 5, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US12362328B2Jul 15, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11538792B2Dec 27, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11791282B2Oct 17, 2023
Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations49