P

Inventor

TSAI HUEI-RU

TW6 patents
⚠️ This page may combine multiple inventors who share the name “TSAI HUEI-RU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

4 patents
US9412653B2Aug 9, 2016

Through silicon via (TSV) process

UNITED MICROELECTRONICS CORP0 citations51
US10446489B2Oct 15, 2019

Interconnect structure

UNITED MICROELECTRONICS CORP0 citations46
US10153231B2Dec 11, 2018

Interconnect structure and fabrication method thereof

UNITED MICROELECTRONICS CORP1 citations46
US10079177B1Sep 18, 2018

Method for forming copper material over substrate

UNITED MICROELECTRONICS CORP0 citations46

Chen jia-jia

2 patents
US9012324B2Apr 21, 2015

Through silicon via process

Chen jia-jia11 citations79
US9136170B2Sep 15, 2015

Through silicon via (TSV) structure and process thereof

Chen jia-jia0 citations48