Inventor

JEONG WOO JAE

KR17 patents

⚠️ This page may combine multiple inventors who share the name “JEONG WOO JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JEONG WOO JAE

LG CHEMICAL LTD

Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist

Photo-curable and thermo-curable resin compostion, and dry film solder resist

Photo-curable and thermo-curable resin composition, and a dry film solder resist

Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same

Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same

Photocurable and thermocurable resin composition and dry film solder resist

Photo-curable and thermo-curable resin composition, and dry film solder resist

Method for manufacturing insulating film and semiconductor package

Photo-curable and heat-curable resin composition and dry film solder resist

Photo-curable and thermo-curable resin composition and dry film solder resist

Preparation method for dry film solder resist and film laminate used therein

KOREA ADVANCED INST SCI & TECH

Device and method for transmitting and receiving emulated Wi-Fi packets

IUCF HYU

MXene fibers and preparation method thereof

CHOI BO-YUN

Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical property

CHOI BYUNG-JU

Printed circuit board including under-fill dam and fabrication method thereof