Inventor
SEO SUNKYOUNG
KR22 patents
⚠️ This page may combine multiple inventors who share the name “SEO SUNKYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS11923342B2Mar 5, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11848293B2Dec 19, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11574873B2Feb 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11444060B2Sep 13, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US11935873B2Mar 19, 2024
Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips
SAMSUNG ELECTRONICS CO LTD1 citations71
US11222873B2Jan 11, 2022
Semiconductor packages including stacked substrates and penetration electrodes
SAMSUNG ELECTRONICS CO LTD3 citations71
US12400980B2Aug 26, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12087696B2Sep 10, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11482509B2Oct 25, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12362344B2Jul 15, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12021073B2Jun 25, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11621250B2Apr 4, 2023
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations61
US11869818B2Jan 9, 2024
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11328966B2May 10, 2022
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11942446B2Mar 26, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11776941B2Oct 3, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12581931B2Mar 17, 2026
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12381185B2Aug 5, 2025
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations50
US11735566B2Aug 22, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11710757B2Jul 25, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11948851B2Apr 2, 2024
Semiconductor package including high thermal conductivity layer
SAMSUNG ELECTRONICS CO LTD0 citations46