Inventor

CHOW KIN YEAN

SG3 patents

Patents

3 patents

US7616448B2Nov 10, 2009

Wrap-around overmold for electronic assembly

DELPHI TECH INC43 citations90

US7455552B1Nov 25, 2008

Overmolded electronic assembly with metal seal ring

DELPHI TECH INC22 citations89

US7462077B2Dec 9, 2008

Overmolded electronic assembly

DELPHI TECH INC5 citations59