Inventor
YONG SIM YING
SG5 patents
Patents
5 patentsUS7616448B2Nov 10, 2009
Wrap-around overmold for electronic assembly
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US7455552B1Nov 25, 2008
Overmolded electronic assembly with metal seal ring
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US7148554B2Dec 12, 2006
Discrete electronic component arrangement including anchoring, thermally conductive pad
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US7462077B2Dec 9, 2008
Overmolded electronic assembly
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US9231124B2Jan 5, 2016
Ball grid array packaged camera device soldered to a substrate
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