Inventor
NAKASHIMA TAKASHI
JP78 patents
⚠️ This page may combine multiple inventors who share the name “NAKASHIMA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MAZDA MOTOR
9 patentsUS5078225AJan 7, 1992
Electric power steering system
MAZDA MOTOR54 citations96
US5020619AJun 4, 1991
Rear wheel steering device for a vehicle
MAZDA MOTOR26 citations91
US4953652ASep 4, 1990
Four-wheel steering system for motor vehicle
MAZDA MOTOR22 citations82
US4926955AMay 22, 1990
Rear wheel steering apparatus for automobile
MAZDA MOTOR21 citations82
US5398240AMar 14, 1995
Multiplex transmission apparatus and multiplex transmission method
MAZDA MOTOR7 citations74
US5201382AApr 13, 1993
Four-wheel-steered vehicle control system
MAZDA MOTOR14 citations74
US5141071AAug 25, 1992
Four-wheel-steered vehicle control system
MAZDA MOTOR14 citations74
US5225983AJul 6, 1993
Rear wheel steering system for motor vehicle
MAZDA MOTOR15 citations72
US5083628AJan 28, 1992
Rear wheel steering device for a vehicle
MAZDA MOTOR6 citations63
SAMSUNG ELECTRONICS CO LTD
5 patentsUS5351213ASep 27, 1994
Integrated semiconductor memory device utilizing a test circuit
SAMSUNG ELECTRONICS CO LTD60 citations96
US5297104AMar 22, 1994
Word line drive circuit of semiconductor memory device
SAMSUNG ELECTRONICS CO LTD99 citations96
US5682054AOct 28, 1997
Rectifying transfer gate device
SAMSUNG ELECTRONICS CO LTD10 citations74
US5604429AFeb 18, 1997
Rectifying transfer gate circuit
SAMSUNG ELECTRONICS CO LTD8 citations74
US5935203AAug 10, 1999
Rectifying transfer gate circuit
SAMSUNG ELECTRONICS CO LTD1 citations63
MITSUI HIGH TEC
4 patentsUS5640047AJun 17, 1997
Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function
MITSUI HIGH TEC353 citations99
US5717252AFeb 10, 1998
Solder-ball connected semiconductor device with a recessed chip mounting area
MITSUI HIGH TEC159 citations98
US5661086AAug 26, 1997
Process for manufacturing a plurality of strip lead frame semiconductor devices
MITSUI HIGH TEC126 citations95
US5614443AMar 25, 1997
Method of producing a frame made of connected semiconductor die mounting substrates
MITSUI HIGH TEC18 citations81
ALPS ELECTRIC CO LTD
4 patentsUS6222811B1Apr 24, 2001
Disc unit with configuration for performing simultaneous inserting and ejecting operations for disc
ALPS ELECTRIC CO LTD31 citations92
US6646973B2Nov 11, 2003
Disk device having disk transferring mechanism capable of shortening disk replacement time
ALPS ELECTRIC CO LTD9 citations74
US6594218B2Jul 15, 2003
Disk device having disk transferring mechanism capable of being made thin
ALPS ELECTRIC CO LTD7 citations74
US6345030B1Feb 5, 2002
Disk apparatus
ALPS ELECTRIC CO LTD11 citations73
MERCIAN CORP
4 patentsUS7256178B2Aug 14, 2007
Physiologically active substances
MERCIAN CORP14 citations83
US7619100B2Nov 17, 2009
Physiologically active substances
MERCIAN CORP7 citations72
US5760238AJun 2, 1998
1,4-dihydropyridine derivatives
MERCIAN CORP7 citations71
US6030951AFeb 29, 2000
Chrysomycin derivative compounds and use as antitumor agents
MERCIAN CORP4 citations62
MITSUBISHI ELECTRIC CORP
3 patentsUS5811871ASep 22, 1998
Semiconductor device comprising a bipolar transistor
MITSUBISHI ELECTRIC CORP27 citations93
US6469366B1Oct 22, 2002
Bipolar transistor with collector diffusion layer formed deep in the substrate
MITSUBISHI ELECTRIC CORP13 citations73
US5960273ASep 28, 1999
Method of manufacturing a semiconductor device including a bipolar transistor
MITSUBISHI ELECTRIC CORP2 citations63
SHARP KK
3 patentsUS7348492B1Mar 25, 2008
Flexible wiring board and electrical device using the same
SHARP KK51 citations92
US5585815ADec 17, 1996
Display having a switching element for disconnecting a scanning conductor line from a scanning conductor line drive element in synchronization with a level fall of an input video signal
SHARP KK40 citations90
US11539547B2Dec 27, 2022
Network system, information processing method, server, and refrigerator
SHARP KK0 citations63
TEXAS INSTRUMENTS INC
3 patentsUS5258331ANov 2, 1993
Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
TEXAS INSTRUMENTS INC38 citations92
US5075760ADec 24, 1991
Semiconductor device package assembly employing flexible tape
TEXAS INSTRUMENTS INC30 citations86
US5176366AJan 5, 1993
Resin-encapsulated semiconductor device package with nonconductive tape embedded between outer lead portions
TEXAS INSTRUMENTS INC19 citations74
RENESAS TECH CORP
2 patentsEISAI R&D MAN CO LTD
2 patentsHITACHI LTD
1 patentNIPPON TELEGRAPH & TELEPHONE
1 patentEISAI CO LTD
1 patentRICOH KK
1 patentTOGO SEISAKUSHO KK
1 patentNEC PLATFORMS LTD
1 patentIWAMOTO TAKAHIRO
1 patentTOYOTA JIDOSHOKKI KK
1 patentSUMITOMO METAL IND
1 patentNGK SPARK PLUG CO
1 patentKYC INC
1 patentShowing the top 50 of 78 patents by PatentIndex Score.