Inventor
ANDRYUSHCHENKO TATYANA
US4 patents
Patents
4 patentsUS9391019B2Jul 12, 2016
Scalable interconnect structures with selective via posts
INTEL CORP26 citations92
US10204855B2Feb 12, 2019
Bendable and stretchable electronic devices and methods
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US6790336B2Sep 14, 2004
Method of fabricating damascene structures in mechanically weak interlayer dielectrics
INTEL CORP9 citations68
US9461010B2Oct 4, 2016
Debond interconnect structures
INTEL CORP0 citations51