Inventor
YANG SHENG-YAO
TW4 patents
Patents
4 patentsUS11088108B2Aug 10, 2021
Chip package structure including ring-like structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12183709B2Dec 31, 2024
Chip package structure with ring-like structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11848302B2Dec 19, 2023
Chip package structure with ring-like structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11545463B2Jan 3, 2023
Chip package structure with ring-like structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61