Inventor
HUBER ANTON
DE30 patents
⚠️ This page may combine multiple inventors who share the name “HUBER ANTON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILTRONIC AG
6 patentsUS6861360B2Mar 1, 2005
Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers
SILTRONIC AG20 citations91
US7077726B2Jul 18, 2006
Semiconductor wafer with improved local flatness, and method for its production
SILTRONIC AG16 citations79
US7767470B2Aug 3, 2010
Semiconductor wafers with highly precise edge profile and method for producing them
SILTRONIC AG2 citations60
US7108583B1Sep 19, 2006
Method for removing material from a semiconductor wafer
SILTRONIC AG6 citations60
US7704126B2Apr 27, 2010
Method for producing a semiconductor wafer with profiled edge
SILTRONIC AG6 citations58
US7766724B2Aug 3, 2010
Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers
SILTRONIC AG5 citations55
SIEMENS AG
4 patentsUS4927382AMay 22, 1990
Electrical function group for a vehicle
SIEMENS AG57 citations96
US5416360AMay 16, 1995
Circuit configuration for the passenger protection device of a vehicle
SIEMENS AG30 citations91
US4595966AJun 17, 1986
For the protection of an MOS-transistor from overloading
SIEMENS AG16 citations74
US5327014AJul 5, 1994
Firing control device for triggering a passenger restraint system of a vehicle
SIEMENS AG10 citations73
HUBER ANTON
4 patentsUS9073135B2Jul 7, 2015
Method for slicing wafers from a workpiece
HUBER ANTON2 citations57
US10245661B2Apr 2, 2019
Wire guide roll for wire saw and method
HUBER ANTON1 citations54
US8276508B2Oct 2, 2012
Overload protection, drive train comprising such an overload protection, device comprising a lifting tool, and method for applying working forces
HUBER ANTON1 citations47
US8746227B2Jun 10, 2014
Method for slicing wafers from a workpiece
HUBER ANTON0 citations36