Inventor
MCLACHLAN CRAIG J
US13 patents
⚠️ This page may combine multiple inventors who share the name “MCLACHLAN CRAIG J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HARRIS CORP
12 patentsUS5034343AJul 23, 1991
Manufacturing ultra-thin wafer using a handle wafer
HARRIS CORP171 citations97
US5929508AJul 27, 1999
Defect gettering by induced stress
HARRIS CORP107 citations96
US5091331AFeb 25, 1992
Ultra-thin circuit fabrication by controlled wafer debonding
HARRIS CORP84 citations95
US4968628ANov 6, 1990
Method of fabricating back diffused bonded oxide substrates
HARRIS CORP28 citations92
US5266135ANov 30, 1993
Wafer bonding process employing liquid oxidant
HARRIS CORP29 citations91
US4916497AApr 10, 1990
Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
HARRIS CORP20 citations82
US5334273AAug 2, 1994
Wafer bonding using trapped oxidizing vapor
HARRIS CORP17 citations80
US4554059ANov 19, 1985
Electrochemical dielectric isolation technique
HARRIS CORP22 citations78
US5585661ADec 17, 1996
Sub-micron bonded SOI by trench planarization
HARRIS CORP17 citations73
US5070596ADec 10, 1991
Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
HARRIS CORP13 citations73
US5750432AMay 12, 1998
Defect control in formation of dielectrically isolated semiconductor device regions
HARRIS CORP6 citations62
US5037765AAug 6, 1991
Method of fabricating integrated circuits including photo optical devices and pressure transducers
HARRIS CORP2 citations62