P

Inventor

ROUSE GEORGE V

US25 patents
⚠️ This page may combine multiple inventors who share the name “ROUSE GEORGE V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HARRIS CORP

17 patents
US5849627ADec 15, 1998

Bonded wafer processing with oxidative bonding

HARRIS CORP178 citations99
US5569620AOct 29, 1996

Bonded wafer processing with metal silicidation

HARRIS CORP194 citations99
US5387555AFeb 7, 1995

Bonded wafer processing with metal silicidation

HARRIS CORP149 citations99
US5034343AJul 23, 1991

Manufacturing ultra-thin wafer using a handle wafer

HARRIS CORP171 citations97
US5744852AApr 28, 1998

Bonded wafer

HARRIS CORP68 citations96
US5517047AMay 14, 1996

Bonded wafer processing

HARRIS CORP53 citations96
US5362667ANov 8, 1994

Bonded wafer processing

HARRIS CORP93 citations96
US5240876AAug 31, 1993

Method of fabricating SOI wafer with SiGe as an etchback film in a BESOI process

HARRIS CORP90 citations96
US5218213AJun 8, 1993

SOI wafer with sige

HARRIS CORP83 citations96
US5091331AFeb 25, 1992

Ultra-thin circuit fabrication by controlled wafer debonding

HARRIS CORP84 citations95
US5603779AFeb 18, 1997

Bonded wafer and method of fabrication thereof

HARRIS CORP35 citations92
US4968628ANov 6, 1990

Method of fabricating back diffused bonded oxide substrates

HARRIS CORP28 citations92
US5266135ANov 30, 1993

Wafer bonding process employing liquid oxidant

HARRIS CORP29 citations91
US5081061AJan 14, 1992

Manufacturing ultra-thin dielectrically isolated wafers

HARRIS CORP38 citations91
US4851078AJul 25, 1989

Dielectric isolation process using double wafer bonding

HARRIS CORP52 citations91
US5932022AAug 3, 1999

SC-2 based pre-thermal treatment wafer cleaning process

HARRIS CORP51 citations85
US5334273AAug 2, 1994

Wafer bonding using trapped oxidizing vapor

HARRIS CORP17 citations80

INTERSIL CORP

4 patents

INTERSIL INC

3 patents

FAIRCHILD SEMICONDUCTOR

1 patent